ABSOLUTE MAXIMUM RATINGS

(1)

PIN ASSIGNMENTS

1

2

3

4

8

7

6

5

+V

S

OutB

-InB

+InB

OutA

-InA

+InA

-VS

A

B

TopView

SO-8

TopView

MSOP-10

1

2

3

4

5

10

9

8

7

6

-InA

OutA

+V

S

OutB

-InB

+InA

DISA

-VS

DISB

+InB

OPA2889

SBOS373B – JUNE 2007 – REVISED AUGUST 2008 ....................................................................................................................................................... www.ti.com

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

ORDERING INFORMATION(1)

SPECIFIED

PACKAGE

TEMPERATURE

PACKAGE

ORDERING

TRANSPORT

PRODUCT

PACKAGE-LEAD

DESIGNATOR

RANGE

MARKING

NUMBER

MEDIA, QUANTITY

OPA2889ID

Rail, 75

OPA2889

SO-8

D

–40°C to +85°C

OP2889

OPA2889IDR

Tape and Reel, 2500

OPA2889IDGST

Tape and Reel, 250

OPA2889

MSOP-10

DGS

–40°C to +85°C

BZY

OPA2889IDGSR

Tape and Reel, 2500

(1)

For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI

web site at www.ti.com.

Over operating free-air temperature range, unless otherwise noted.

OPA2889

UNIT

Power supply

±6.5

V

Internal power dissipation

See Thermal Characteristics

Input voltage range

±VS

V

Storage temperature range

–65 to +125

°C

Lead temperature (soldering, 10s)

+260

°C

Maximum junction temperature (TJ)

+150

°C

Maximum junction temperature (TJ), continuous operation

+140

°C

ESD Rating:

Human body model (HBM)

2000

V

Charge device model (CDM)

1000

V

Machine model (MM)

150

V

(1)

Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may

degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond

those specified is not implied.

2

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Product Folder Link(s): OPA2889