5 Specifications

5.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

VDD to VSS

Supply voltage

36

V

VDD to GND

–0.3

18

V

VSS to GND

–18

0.3

V

VDIG

Digital input pin (SEL1, SEL2) voltage

GND –0.3

VDD+0.3

V

IDIG

Digital input pin (SEL1, SEL2) current

–30

30

mA

VANA_IN

Analog input pin (Sx) voltage

VSS–0.3

VDD+0.3

V

IANA_IN

Analog input pin (Sx) current

–30

30

mA

VANA_OUT

Analog output pin (D) voltage

VSS–0.3

VDD+0.3

V

IANA_OUT

Analog output pin (D) current

–30

30

mA

TA

Ambient temperature

–55

140

°C

TJ

Junction temperature

150

°C

Tstg

Storage temperature

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress

ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under

Recommended Operating Conditions. Exposure to absolute maximum rated conditions for extended periods may affect device

reliability.

5.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human body model (HBM), per ANSI/ESDA/

JEDEC JS-001, all pins(1)

±2000

V

Charged device model (CDM), per JEDEC

specification JESD22-C101, all pins(2)

±500

(1)

JEDEC document JEP155 states that 500V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250V CDM allows safe manufacturing with a standard ESD control process.

5.3 Thermal Information

THERMAL METRIC(1)

TMUX6136

UNIT

PW (TSSOP)

16 PINS

RθJA

Junction-to-ambient thermal resistance

111.0

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

41.7

°C/W

RθJB

Junction-to-board thermal resistance

57.2

°C/W

ΨJT

Junction-to-top characterization parameter

4.1

°C/W

ΨJB

Junction-to-board characterization parameter

56.6

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

note.

TMUX6136

SCDS397B – NOVEMBER 2018 – REVISED AUGUST 2025

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