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TPS22810

SLVSDH0C – DECEMBER 2016 – REVISED JANUARY 2018

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Copyright © 2016–2018, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltage values are with respect to network ground terminal.

7 Specifications

7.1 Absolute Maximum Ratings

Over operating free-air temperature range (unless otherwise noted)

(1) (2)

MIN

MAX

UNIT

VIN

Input voltage

–0.3

20

V

VOUT

Output voltage

–0.3

min(VIN + 0.3, 20)

V

VEN/UVLO

EN/UVLO voltage

–0.3

20

V

TJ

Maximum junction temperature

150

°C

Tstg

Storage temperature

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with

less than 500-V HBM is possible with the necessary precautions.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with

less than 250-V CDM is possible with the necessary precautions.

7.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic

discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1)

±2000

V

Charged-device model (CDM), per JEDEC specification JESD22-C101 (2)

±1000

(1)

In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may

have to be derated. Maximum ambient temperature [TA(max)] is dependent on the maximum operating junction temperature [TJ(MAX)], the

maximum power dissipation of the device in the application [PD(MAX)], and the junction-to-ambient thermal resistance of the part/package

in the application (θJA), as given by the following equation: TA(MAX) = TJ(MAX) – (θJA × PD(MAX)).

(2)

See the Detailed Description section.

7.3 Recommended Operating Conditions

Over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

VIN

Input voltage

2.7

18

V

VEN/UVLO

EN/UVLO voltage

0

18

V

VOUT

Output voltage

VIN

V

IMAX

Maximum continuous switch current, TA = 65°C (DBV)

2

A

Maximum continuous switch current, TA = 65°C (DRV)

3

TA

Operating free-air temperature (1)

–40

105

°C

CIN

Input capacitor

1(2)

µF

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

7.4 Thermal Information

THERMAL METRIC (1)

TPS22810

UNIT

DBV (SOT23)

DRV (WSON)

6 PINS

6 PINS

RθJA

Junction-to-ambient thermal resistance

182

74.6

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

127.2

80.3

°C/W

RθJB

Junction-to-board thermal resistance

16.9

44.3

°C/W

ψJT

Junction-to-top characterization parameter

26.4

3.2

°C/W

ψJB

Junction-to-board characterization parameter

36.3

44.6

°C/W