TDA2SA datasheet(333/427 Pages) TI2

Part #	TDA2SA

Description	TDA2x ADAS Applications Processor 23mm Package (ABC Package) Silicon Revision 2.0

PDF	427 Pages

Scroll/Zoom	100%

Manufacturer	TI2 [Texas Instruments]

Direct Link	https://www.ti.com

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333 / 427 page

SWPS040-212

SWPS040-211

333

TDA2SX, TDA2SG, TDA2SA

TDA2HG, TDA2HV, TDA2HF, TDA2LF

www.ti.com

SPRS951F – DECEMBER 2015 – REVISED MAY 2019

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Product Folder Links: TDA2SX TDA2SG TDA2SA TDA2HG TDA2HV TDA2HF TDA2LF

Applications, Implementation, and Layout

Figure 8-4. Poor Via Assignment for PDN

Figure 8-5 shows an improved power net routing with better via assignment and placement,

respectively.

Figure 8-5. Improved Via Assignment for PDN

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To avoid any “ampacity” issue – maximum current-carrying capacity of each transitional via should be

evaluated to determine the appropriate number of vias required to connect components.

Figure 8-6 and Figure 8-7 show examples of “via starvation” on a power net transitioning from top

routing layer to internal layers and the improved layout, respectively. Adding vias to bring the “via-to-

pad” ratio to 1:1 will improve PDN performance.

TDA2SA Datasheet(PDF) 333 Page - Texas Instruments