TDA2SA datasheet(337/427 Pages) TI2

337 / 427 page

Grouped Power/Ground

pins to create 1 equivalent

resistive branch

Multiport net

Branch

Port/Pin

Sources

Sinks

Sources

Sinks

SWPS040-179

337

TDA2SX, TDA2SG, TDA2SA

TDA2HG, TDA2HV, TDA2HF, TDA2LF

www.ti.com

SPRS951F – DECEMBER 2015 – REVISED MAY 2019

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Product Folder Links: TDA2SX TDA2SG TDA2SA TDA2HG TDA2HV TDA2HF TDA2LF

Applications, Implementation, and Layout

The lumped methodology consists of importing the PCB layout database (from Cadence Allegro tool or

any other layout design tool) into the static IR drop modeling and simulation tool of preference for the PCB

designer. This is followed by applying the correct PCB stack-up information (thickness, material

properties) of the PCB dielectric and metallization layers. The material properties of dielectric consist of

permittivity (Dk) and loss tangent (Df).

For the conductor layers, the correct conductivity needs to be programmed into the simulation tool. This is

followed by pin-grouping of the power and ground nets, and applying appropriate voltage/current sources.

The current and voltage information can be obtained from the power and voltage specifications of the

device under different operating conditions / Use Cases.

Figure 8-11. Pin-grouping concept: Lumped and Distributed Methodologies

8.2.4

Step 4: Frequency Analysis

Delivering low noise voltage sources are very important to allowing a system to operate at the lowest

possible Operational Performance Point (OPP) for any one Use Case. An OPP is a combination of the

supply voltage level and clocking rate for key internal processor domains. A SCH and PCB designed to

provide low noise voltage supplies will then enable the processor to enter optimal OPPs for each Use

Case that in turn will minimize power dissipation and junction temperatures on-die. Therefore, it is a good

engineering practice to perform a Frequency Analysis over the key power domains.

Frequency analysis and design methodology results in a PDN design that minimizes transient noise

voltages at the processor’s input power balls. This allows the processor’s internal transistors to operate

near the minimum specified operating supply voltage levels. To accomplish this one must evaluate how a

voltage supply will change due to impedance variations over frequency. This analysis will focus on the

decoupling capacitor network (VDD_xxx and VSS/Gnd rails) at the load. Sufficient capacitance with a

distribution of self-resonant points will provide for an overall lower impedance vs frequency response for

each power domain.

Decoupling components that are distant from their load’s input power are susceptible to encountering

spreading loop inductance from the PCB design. Early analysis of each key power domain’s frequency

response helps to determine basic decoupling capacitor placement, optimal footprint, layer assignment,

and types needed for minimizing supply voltage noise/fluctuations due to switching and load current

transients.

NOTE

Evaluation of loop inductance values for decoupling capacitors placed ~300mils closer to the

load’s input power balls has shown an 18% reduction in loop inductance due to reduced

distance.

•

Decoupling capacitors must be carefully placed in order to minimize loop inductance impact on supply

voltage transients. A real capacitor has characteristics not only of capacitance but also inductance and

resistance.

Figure 8-12 shows the parasitic model of a real capacitor. A real capacitor must be treated as an RLC

circuit with effective series resistance (ESR) and effective series inductance (ESL).

TDA2SA Datasheet(PDF) 337 Page - Texas Instruments

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