TDA2SA datasheet(342/427 Pages) TI2

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TDA2SX, TDA2SG, TDA2SA

TDA2HG, TDA2HV, TDA2HF, TDA2LF

SPRS951F – DECEMBER 2015 – REVISED MAY 2019

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Applications, Implementation, and Layout

Figure 8-17. Trace Examples

•

Always route signal traces and their associated ground returns as close to one another as possible to

minimize the loop area enclosed by current flow:

–

At high frequencies current follows the path of least inductance.

–

At low frequencies current flows through the path of least resistance.

8.2.6

EMI / EMC Issues Prevention

All high-speed digital integrated circuits can be sources of unwanted radiation, which can affect nearby

sensitive circuitry and cause the final product to have radiated emissions levels above the limits allowed

by the EMC regulations if some preventative steps are not taken.

Likewise, analog and digital circuits can be susceptible to interference from the outside world and picked

up by the circuitry interconnections.

To minimize the potential for EMI/EMC issues, the following guidelines are recommended to be followed.

8.2.6.1

Signal Bandwidth

To evaluate the frequency of a digital signal, an estimated rule of thumb is to consider its bandwidth fBW

with respect to its rise time, tR:

fBW ≈ 0.35 / tR

This frequency actually corresponds to the break point in the signal spectrum, where the harmonics start

to decay at 40 dB per decade instead of 20 dB per decade.

8.2.6.2

Signal Routing

8.2.6.2.1 Signal Routing—Sensitive Signals and Shielding

Keep radio frequency (RF) sensitive circuitry (like GPS receivers, GSM/WCDMA, Bluetooth/WLAN

transceivers, frequency modulation (FM) radio) away from high-speed ICs (the device, power and audio

manager, chargers, memories, and so forth) and ideally on the opposite side of the PCB. For improved

protection it is recommended to place these emission sources in a shield can. If the shield can have a

removable lid (two-piece shield), ensure there is low contact impedance between the fence and the lid.

Leave some space between the lid and the components under it to limit the high-frequency currents

induced in the lid. Limit the shield size to put any potential shield resonances above the frequencies of

interest; see Figure 8-14, Typical Impedance Profile of a Capacitor.

8.2.6.2.2 Signal Routing—Outer Layer Routing

In case there is a need to use the outer layers for routing outside of shielded areas, it is recommended to

route only static signals and ensure that these static signals do not carry any high-frequency components

(due to parasitic coupling with other signals). In case of long traces, make provision for a bypass capacitor

near the signal source.

TDA2SA Datasheet(PDF) 342 Page - Texas Instruments

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