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LT6370 Datasheet(PDF) 19 Page - Analog Devices |
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LT6370 Datasheet(HTML) 19 Page - Analog Devices |
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19 / 28 page ![]() LT6370 19 Rev. 0 For more information www.analog.com APPLICATIONS INFORMATION selected for low thermal EMF characteristics. Furthermore, the number, type, and layout of junctions should be matched for both inputs with respect to thermal gradients on the cir- cuit board. Doing so may involve deliberately introducing dummy junctions to offset unavoidable junctions. Air currents can also lead to thermal gradients and cause significant noise in measurement systems. It is important to prevent airflow across sensitive circuits. Doing so will often reduce thermocouple noise substantially. Placing PCB input traces close together, and on an internal PCB layer, can help minimize temperature differentials result- ing from air currents reacting with the input trace thermal surface area. Figure 4. TEMPERATURE (°C) 25 1.8 2.4 3.0 2.8 2.6 2.0 2.2 1.4 1.6 0.8 1.0 0.2 0.4 30 40 45 6370 F04 1.2 0.6 0 35 Thermal EMF Generated by Two Copper Wires From Different Manufacturers Figure 5. Solder-Copper Thermal EMFs SOLDER-COPPER JUNCTION DIFFERENTIAL TEMPERATURE SOURCE: NEW ELECTRONICS 02-06-77 0 0 50 40 6370 F05 –50 –100 10 20 30 50 100 SLOPE ≈ 1.5µV/°C BELOW 25°C SLOPE ≈ 160nV/°C BELOW 25°C 64% SN/36% Pb 60% Cd/40% SN Reducing Board-Related Leakage Effects Leakage currents can have a significant impact on sys- tem accuracy, particularly in high temperature and high voltage applications. Quality insulation materials should be used, and insulating surfaces should be cleaned to remove fluxes and other residues. For humid environ- ments, surface coating may be necessary to provide a moisture barrier. Leakage into the RG pin conducts through the on-chip feedback resistor, creating an error at the output of the pre-amplifiers. This error is independent of gain and degrades accuracy the most at low gains. This leakage can be minimized by encircling the RG connections with a guard-ring operated at a potential very close to that of the RG pins. The DFN package has NC pins adjacent to each RG pin which can be used to simplify the implementa- tion of this guard-ring. These NC pins do not provide any bias and have no internal connections. In some cases, the guard-ring can be connected to the input voltage which biases one diode drop below RG. Figure 6. 6370 F06 –IN –RG +IN +RG RG LT6370 Guard-Rings Can Be Used to Minimize Leakage into the RG Pins Leakage into the input pins reacts with the source resis- tance, creating an error directly at the input. This leakage can be minimized by encircling the input connections with a guard-rings operated at a potential very close to that of the input pins. In some cases, the guard-ring can be connected to RG which biases one diode above the input. Figure 7. 6370 F07 –IN –RG +IN +RG RG LT6370 Guard-Rings Can Be Used to Minimize Leakage into the Input Pins |
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