AD5422 datasheet(9/29 Pages) AD

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Preliminary Technical Data

AD5420

Rev. PrD | Page 9 of 29

ABSOLUTE MAXIMUM RATINGS

TA = 25°C unless otherwise noted.

Transient currents of up to 100 mA do not cause SCR latch-up.

Table 5.

Parameter

Rating

AVDD to AGND, DGND

−0.3V to 60V

DVCC to AGND, DGND

−0.3 V to +7 V

Digital Inputs to AGND, DGND

−0.3 V to DVCC + 0.3 V or 7 V

(whichever is less)

Digital Outputs to AGND, DGND

−0.3 V to DVCC + 0.3 V or 7V

(whichever is less)

REFIN/REFOUT to AGND, DGND

−0.3 V to +7 V

IOUT to AGND, DGND

−0.3V to AVDD

AGND to DGND

-0.3V to +0.3V

Operating Temperature Range

Industrial

−40°C to +851°C

Storage Temperature Range

−65°C to +150°C

Junction Temperature (TJ max)

125°C

24-Lead TSSOP Package

θJA Thermal Impedance

42°C/W

40-Lead LFCSP Package

θJA Thermal Impedance

28°C/W

Power Dissipation

(TJ max – TA)/ θJA

Lead Temperature

JEDEC Industry Standard

Soldering

J-STD-020

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

ESD CAUTION

1 Power dissipated on chip must be de-rated to keep junction temperature

below 125°C. Assumption is max power dissipation condition is sourcing

24mA into Ground from AVDD with a 3mA on-chip current.

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