PCA9601DPZ datasheet(31/31 Pages) NXP

31 / 31 page

NXP Semiconductors

PCA9601

Dual bidirectional bus buffer

Contents

General description ............................................ 1

Features and benefits .........................................1

Applications .........................................................2

Ordering information .......................................... 2

4.1

Ordering options ................................................ 2

Block diagram ..................................................... 2

Pinning information ............................................ 3

6.1

Pinning ...............................................................3

6.2

Pin description ................................................... 3

Functional description ........................................3

7.1

Static level offset card side ................................3

7.1.1

Fast-mode operation ..........................................4

7.1.2

Fast-mode Plus operation ................................. 4

7.2

High drive, long distance side ........................... 4

7.3

Connections to other bus buffers .......................5

7.4

Comparison of PCA9601/PCA9600 and

P82B96 .............................................................. 5

Limiting values ....................................................6

Characteristics .................................................... 7

Application information ....................................11

10.1

Calculating system delays and bus clock

frequency ......................................................... 13

10.2

Negative undershoot below absolute

minimum value ................................................ 17

10.2.1

Example with questions and answers ..............18

Package outline .................................................22

Soldering of SMD packages .............................24

12.1

Introduction to soldering .................................. 24

12.2

Wave and reflow soldering .............................. 24

12.3

Wave soldering ................................................24

12.4

Reflow soldering .............................................. 24

Abbreviations .................................................... 26

Revision history ................................................ 27

Legal information ..............................................28

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section 'Legal information'.

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 4 January 2022

Document identifier: PCA9601

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