MP26101 – 2A, 24V INPUT, 1.1MHz 1- OR 2- CELL SWITCHING LI-ION BATTERY CHARGER

MP26101 Rev. 1.01

www.MonolithicPower.com

2

8/4/2020

MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.

© 2020 MPS. All Rights Reserved.

ORDERING INFORMATION

Part Number*

Package

Top Marking

MP26101DR

QFN16 (4×4mm)

M26101

* For Tape & Reel, add suffix-z (e.g. MP26101DR-Z);

For RoHS Compliant packaging, add suffix-LF (e.g. MP26101DR-LF-Z)

PACKAGE REFERENCE

TOP VIEW

PIN 1 ID

NTC

ACOK

CHGOK

VREF33

GND

CSP

BATT

COMPI

1

2

3

4

13

14

15

16

8

7

6

5

12

11

10

9

EXPOSED PAD

ON BACKSIDE

ABSOLUTE MAXIMUM RATINGS (1)

Supply Voltage VIN ........................................ 26V

VSW ......................................-0.3V to (VIN + 0.3V)

VBST........................................................VSW + 6V

VCSP, VBATT, ................................... -0.3V to +18V

All Other Pins .................................. -0.3V to +6V

Continuous Power Dissipation

(TA = 25°C) (2)

............................................................... 2.7W

Junction Temperature............................... 150°C

Lead Temperature .................................... 260°C

Storage Temperature................-65°C to +150°C

Recommended Operating Conditions (3)

Supply Voltage VIN .............................. 5V to 24V

Maximum Junction Temp. (TJ) ................ 125°C

Thermal Resistance (4)

θJA

θJC

QFN16 (4×4mm)..................... 46....... 10 ... °C/W

Notes:

1) Exceeding these ratings may damage the device.

2) The maximum allowable power dissipation is a function of the

maximum junction temperature TJ(MAX),

the junction-to-

ambient thermal resistance θJA, and the ambient temperature

TA. The maximum allowable continuous power dissipation at

any ambient temperature is calculated by PD(MAX)=(TJ(MAX)-

TA)/ θJA. Exceeding the maximum allowable power dissipation

will cause excessive die temperature, and the regulator will go

into thermal shutdown. Internal thermal shutdown circuitry

protects the device from permanent damage.

3) The device is not guaranteed to function outside of its

operating conditions.

4) Measured on JESD51-7 4-layer board.