TPS73601DBVT datasheet(28/49 Pages) TI2

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8 Device and Documentation Support

8.1 Device Support

8.1.1 Development Support

8.1.1.1 Evaluation Modules

An evaluation module (EVM) is available to assist in the initial circuit performance evaluation using the TPS736.

The TPS73601DRBEVM-518 evaluation module (and related user guide) can be requested at the Texas

Instruments website through the product folders or purchased directly from the TI eStore.

8.1.1.2 Spice Models

Computer simulation of circuit performance using SPICE is often useful when analyzing the performance of

analog circuits and systems. A SPICE model for the TPS736 is available through the product folders under

Simulation Models.

8.1.2 Device Nomenclature

Table 8-1. Device Nomenclature

PRODUCT(1)

DESCRIPTION

TPS736xxyyy z(M3)

xx is the nominal output voltage (for example, 25 = 2.5V; 01 = Adjustable).

yyy is the package designator.

z is the package quantity.

M3 is a suffix designator for devices that only use the latest manufacturing flow (CSO: RFB).

Devices without this suffix ship with the legacy silicon (CSO: DLN) or the new silicon (CSO:

RFB). The reel packaging label provides CSO information to distinguish which silicon is being

used. Device performance for new and legacy silicon is denoted throughout the document.

(1)

For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI

web site at www.ti.com.

8.2 Documentation Support

8.2.1 Related Documentation

For related documentation see the following:

• Texas Instruments, Regulating VOUT Below 1.2V Using an External Reference application note

• Texas Instruments, TPS73x01DRBEVM-518 user's guide

8.3 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on

Notifications to register and receive a weekly digest of any product information that has changed. For change

details, review the revision history included in any revised document.

8.4 Support Resources

TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight

from the experts. Search existing answers or ask your own question to get the quick design help you need.

Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do

not necessarily reflect TI's views; see TI's Terms of Use.

8.5 Trademarks

TI E2E™ is a trademark of Texas Instruments.

All trademarks are the property of their respective owners.

8.6 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled

with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may

be more susceptible to damage because very small parametric changes could cause the device not to meet its published

specifications.

TPS736

SBVS038X – SEPTEMBER 2003 – REVISED MAY 2025

www.ti.com

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