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DRA752ABC Datasheet(PDF) 146 Page - Texas Instruments |
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DRA752ABC Datasheet(HTML) 146 Page - Texas Instruments |
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146 / 443 page ![]() 146 DRA756, DRA755, DRA754, DRA752 DRA751, DRA750, DRA746, DRA745, DRA744 SPRS950F – DECEMBER 2015 – REVISED MAY 2019 www.ti.com Submit Documentation Feedback Product Folder Links: DRA756 DRA755 DRA754 DRA752 DRA751 DRA750 DRA746 DRA745 DRA744 Specifications Copyright © 2015–2019, Texas Instruments Incorporated Table 5-4. Recommended Operating Conditions (continued) PARAMETER DESCRIPTION MIN (2) NOM MAX DC (3) MAX (2) UNIT vddshv6 Dual Voltage (1.8V or 3.3V) power supply for the VIN1 Power Group pins 1.8-V Mode 1.71 1.80 1.836 1.89 V 3.3-V Mode 3.135 3.30 3.366 3.465 Maximum noise (peak- peak) 1.8-V Mode 50 mVPPmax 3.3-V Mode vddshv7 Dual Voltage (1.8V or 3.3V) power supply for the WIFI Power Group pins 1.8-V Mode 1.71 1.80 1.836 1.89 V 3.3-V Mode 3.135 3.30 3.366 3.465 Maximum noise (peak- peak) 1.8-V Mode 50 mVPPmax 3.3-V Mode vddshv8 Dual Voltage (1.8V or 3.3V) power supply for the MMC1 Power Group pins 1.8-V Mode 1.71 1.80 1.836 1.89 V 3.3-V Mode 3.135 3.30 3.366 3.465 Maximum noise (peak- peak) 1.8-V Mode 50 mVPPmax 3.3-V Mode vddshv9 Dual Voltage (1.8V or 3.3V) power supply for the RGMII Power Group pins 1.8-V Mode 1.71 1.80 1.836 1.89 V 3.3-V Mode 3.135 3.30 3.366 3.465 Maximum noise (peak- peak) 1.8-V Mode 50 mVPPmax 3.3-V Mode vss Ground supply 0 V vssa_hdmi DPLL_HDMI and HDMI PHY analog ground 0 V vssa_pcie PCIe analog ground 0 V vssa_usb HS USB1 and HS USB2 analog ground 0 V vssa_usb3 DPLL_USB and USB3.0 RX/TX analog ground 0 V vssa_video DPLL_VIDEO1 and DPLL_VIDEO2 analog ground 0 V vssa_osc0 OSC0 analog ground 0 V vssa_osc1 OSC1 analog ground 0 V TJ (1) Operating junction temperature range Automotive -40 125(5) °C ddr1_vref0 Reference Power Supply DDR1 0.5*vdds_ddr1 V ddr2_vref0 Reference Power Supply DDR2 0.5*vdds_ddr2 V (1) Refer to Power on Hours table Table 5-3 for limitations. (2) The voltage at the device ball should never be below the MIN voltage or above the MAX voltage for any amount of time. This requirement includes dynamic voltage events such as AC ripple, voltage transients, voltage dips, etc. (3) The DC voltage at the device ball should never be above the MAX DC voltage to avoid impact on device reliability and lifetime POH (Power-On-Hours). The MAX DC voltage is defined as the highest allowed DC regulated voltage, without transients, seen at the ball. (4) If DDR2 type of memories are used, the EMIF power supply (vdds_ddrx) and the corresponding bias power supply (vdds18v_ddrx) must be sourced from single power source. (5) The TSHUT feature of the SoC resets the device by default when one of the on-die temp sensors reports 123°C. This is intended to protect the device from exceeding 125°C. Though not recommended, the TSHUT temperature threshold can be modified in software if other mechanisms are in place to avoid exceeding 125°C. Refer to the device TRM for details on the TSHUT feature. 5.5 Operating Performance Points This section describes the operating conditions of the device. This section also contains the description of each OPP (operating performance point) for processor clocks and device core clocks. |
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