TMUX7201 datasheet(3/43 Pages) TI2

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4 Pin Configuration and Functions

VSS

GND

SEL

VDD

Not to scale

Figure 4-1. DGK Package, 8-Pin VSSOP (Top View)

VSS

SEL

GND

VDD

Not to scale

Thermal

Pad

Figure 4-2. RQX Package, 8-Pin WSON (Top View)

Table 4-1. Pin Functions

TYPE(1)

DESCRIPTION(2)

NAME

NO.

I/O

Source pin. Can be an input or output.

No connection. Not internally connected.

GND

Ground (0V) reference

VDD

Positive power supply. This pin is the most positive power-supply potential. For reliable operation, connect a

decoupling capacitor ranging from 0.1 µF to 10 µF between VDD and GND.

No connection. Not internally connected.

SEL

Logic control input, has internal Pull-Down resistor. For information about the switch connection controls, see

Section 7.5.

VSS

Negative power supply. This pin is the most negative power-supply potential. In single-supply applications, this pin

can be connected to ground. For reliable operation, connect a decoupling capacitor ranging from 0.1 µF to 10 µF

between VSS and GND.

I/O

Drain pin. Can be an input or output.

Thermal Pad

—

The thermal pad is not connected internally. No requirement to solder this pad, if connected it is recommended that

the pad be left floating or tied to GND

(1)

I = input, O = output, I/O = input or output, P = power, NC = no connection.

(2)

For what to do with unused pins, refer to Section 7.4.

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TMUX7201, TMUX7202

SCDS443C – OCTOBER 2022 – REVISED OCTOBER 2024

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