LTM4601A datasheet(19/28 Pages) LINER

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LTM4601A/LTM4601A-1

4601afb

Tables 3 and 4 provide a summary of the equivalent

θJA

for the noted conditions. These equivalent

θJA parameters

are correlated to the measured values, and are improved

with air ﬂow. The case temperature is maintained at 100°C

or below for the derating curves. The maximum case

temperature of 100°C is to allow for a rise of about 13°C

to 25°C inside the μModule with a thermal resistance

θJC

from junction to case between 6°C/W to 9°C/W. This will

maintain the maximum junction temperature inside the

μModule below 125°C.

Safety Considerations

The LTM4601A modules do not provide isolation from

VIN to VOUT. There is no internal fuse. If required, a

slow blow fuse with a rating twice the maximum input

current needs to be provided to protect each unit from

catastrophic failure.

Layout Checklist/Example

The high integration of LTM4601A makes the PCB board

layout very simple and easy. However, to optimize its

electrical and thermal performance, some layout consid-

erations are still necessary.

• Use large PCB copper areas for high current path, in-

cluding VIN, PGND and VOUT. It helps to minimize the

PCB conduction loss and thermal stress.

• Place high frequency ceramic input and output capaci-

tors next to the VIN, PGND and VOUT pins to minimize

high frequency noise.

• Place a dedicated power ground layer underneath the

unit. Refer frequency synchronization source to power

ground.

• To minimize the via conduction loss and reduce module

thermal stress, use multiple vias for interconnection

between top layer and other power layers.

• Do not put vias directly on pads unless they are capped.

• Use a separated SGND ground copper area for com-

ponents connected to signal pins. Connect the SGND

to PGND underneath the unit.

Figure 15 gives a good example of the recommended

layout.

Figure 15. Recommended Layout

APPLICATIONS INFORMATION

SIGNAL

GND

CONTROL

VOUT

VIN

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PGND

COUT

CIN

COUT

4601A F15

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