LTC2216 datasheet(30/36 Pages) LINER

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LTC2216/LTC2215

22165f

Grounding and Bypassing

TheLTC2216/LTC2215requiresaprintedcircuitboardwitha

clean unbroken ground plane; a multilayer board with an

internal ground plane is recommended. The pinout of the

LTC2216/LTC2215 has been optimized for a ﬂowthrough

layout so that the interaction between inputs and digital

outputs is minimized. Layout for the printed circuit board

should ensure that digital and analog signal lines are

separated as much as possible. In particular, care should

be taken not to run any digital track alongside an analog

signal track or underneath the ADC.

High quality ceramic bypass capacitors should be used

at the VDD, VCM, and OVDD pins. Bypass capacitors must

be located as close to the pins as possible. The traces

connecting the pins and bypass capacitors must be kept

short and should be made as wide as possible.

The LTC2216/LTC2215 differential inputs should run

parallel and close to each other. The input traces should

be as short as possible to minimize capacitance and to

minimize noise pickup.

Heat Transfer

Most of the heat generated by the LTC2216/LTC2215 is

transferred from the die through the bottom-side exposed

pad. For good electrical and thermal performance, the

exposed pad must be soldered to a large grounded pad

on the PC board. It is critical that the exposed pad and all

ground pins are connected to a ground plane of sufﬁcient

area with as many vias as possible.

APPLICATIONS INFORMATION

LTC2216 Datasheet(PDF) 30 Page - Linear Technology