LPC1759 datasheet(38/64 Pages) NXP

Part #	LPC1759

Description	32-bit ARM Cortex-M3 MCU; up to 512 kB flash and 64 kB SRAM with Ethernet, USB 2.0 Host/Device/OTG, CAN

PDF	64 Pages

Scroll/Zoom	100%

Manufacturer	NXP [NXP Semiconductors]

Direct Link	http://www.nxp.com

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38 / 64 page

LPC1759_58_56_54_52_51_4

Product data sheet

Rev. 04 — 26 January 2010

38 of 64

NXP Semiconductors

LPC1759/58/56/54/52/51

32-bit ARM Cortex-M3 microcontroller

Thermal characteristics

9.1 Thermal characteristics

The average chip junction temperature, TJ (°C), can be calculated using the following

equation:

(1)

• Tamb = ambient temperature (°C),

• Rth(j-a) = the package junction-to-ambient thermal resistance (°C/W)

• PD = sum of internal and I/O power dissipation

The internal power dissipation is the product of IDD and VDD. The I/O power dissipation of

the I/O pins is often small and many times can be negligible. However it can be significant

in some applications.

amb

th j

–

()

Table 5.

Thermal characteristics

VDD = 2.4 V to 3.6 V; Tamb = −40 °C to +85 °C unless otherwise specified;

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

Tj(max)

maximum junction

temperature

125

°C

LPC1759 Datasheet(PDF) 38 Page - NXP Semiconductors