Chapter 1: Cyclone III Device Data Sheet

1–23

Switching Characteristics

© January 2010

Altera Corporation

Cyclone III Device Handbook, Volume 2

External Memory Interface Specifications

Cyclone III devices support external memory interfaces up to 200 MHz. The external

memory interfaces for Cyclone III devices are auto-calibrating and easy to implement.

board design guidelines, timing analysis, simulation, and debugging information,

refer to Literature: External Memory Interfaces.

Table 1–32 lists the FPGA sampling window specifications for Cyclone III devices.

Table 1–32. Cyclone III Devices FPGA Sampling Window (SW) Requirement – Read Side (Note 1)

Memory Standard

Column I/Os

Row I/Os

Wraparound Mode

Setup

Hold

Setup

Hold

Setup

Hold

C6

DDR2 SDRAM

580

550

690

640

850

800

DDR SDRAM

585

535

700

650

870

820

QDRII SRAM

785

735

805

755

905

855

C7

DDR2 SDRAM

705

650

770

715

985

930

DDR SDRAM

675

620

795

740

970

915

QDRII SRAM

900

845

910

855

1085

1030

C8

DDR2 SDRAM

785

720

930

870

1115

1055

DDR SDRAM

800

740

915

855

1185

1125

QDRII SRAM

1050

990

1065

1005

1210

1150

I7

DDR2 SDRAM

765

710

855

800

1040

985

DDR SDRAM

745

690

880

825

1000

945

QDRII SRAM

945

890

955

900

1130

1075

A7

DDR2 SDRAM

805

745

1020

960

1145

1085

DDR SDRAM

880

820

955

935

1220

1160

QDRII SRAM

1090

1030

1105

1045

1250

1190

Note to Table 1–32:

(1) Column I/Os refer to top and bottom I/Os. Row I/Os refer to right and left I/Os. Wraparound mode refers to the combination of column and row

I/Os.