9

sRecommended Temperature Profile

HRS test condition

Solder method

:Reflow, IR

Solder composition

:Paste, 96.5%Sn/3.0%Ag/0.5%Cu

(Senju Metal Industry, Co., Ltd.'s Part

Number:M705-221CM5-32-10.5)

Test board

:Glass epoxy

55mm∞150mm∞1.6mm thick

Land,Metal mask dimensions : Our recommendations

The temperature profiles are based on the above conditions.

In individual applications the actual temperature may vary,

depending on solder paste type, volume/thickness and

board size/thickness. Consult your solder paste and

equipment manufacturer for specific recommendations.

MAX 250ç

Start

(ç)

Time (Seconds)

60

25ç (60sec.)

(60sec.)

90 sec. to 120 sec.

Preheating

Soldering

0

50

100

150

150ç

200ç

230ç

200

250

120

The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.