PCA88021 datasheet(23/34 Pages) NXP

23 / 34 page

PCA8802_1

Product data sheet

Rev. 01 — 19 February 2009

23 of 34

NXP Semiconductors

PCA8802

Smartcard RTC

13. Bare die information

13.1 Locations

[1]

All coordinates are referenced, in

µm, to the center of the die (see Figure 30 and Figure 31).

[2]

The substrate (rear side of the die) is wired to VSS but should not be electrically connected.

[3]

Die size before dicing. Final dimensions will be 10

µm to 20 µm smaller.

13.2 PCB or foil landing site

The layout of the landing sites is important. It is recommended to follow the following

guidelines

1. All landing sites should be the same size. When one site has a different size or shape,

e.g. to indicate pad one, then the pull on the die produced by the surface tension of

the solder will be different in one place. This variation can lead to the die not laying ﬂat

on the Printed-Circuit Board (PCB) or foil. This can also result in weak solder joints for

some pins.

2. It is recommended to use circular landing sites of the same diameter as the solder

ball. This will help with self alignment. Solder bump dimensions may be found in

Figure 30.

Table 13.

Bump and reference point locations

Symbol

Pad

Coordinates[1]

INT

437

−396

VDD

−12

−430

TEST

−460

−396

OSCO

−460

OSCI

−460

396

VSS[2]

−12

430

SCL

437

396

SDA

437

pin 1 identiﬁer

474.7

−472.0

bottom left die corner[3] -

−594.8

−568.2

top right die corner[3]

594.7

568.3

Pin 1 is identiﬁed by this symbol.

Fig 28. Pin 1 identiﬁer

001aaj154

REF

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