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L7200 Datasheet(PDF) 37 Page - Intel Corporation |
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L7200 Datasheet(HTML) 37 Page - Intel Corporation |
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37 / 91 page ![]() Datasheet 37 Electrical Specifications NOTES: 1. Unless otherwise noted, all specifications in this table apply to all processor frequencies. 2. VIL is defined as the maximum voltage level at a receiving agent that will be interpreted as a logical low value. 3. VIH is defined as the minimum voltage level at a receiving agent that will be interpreted as a logical high value. 4. VIH and VOH may experience excursions above VCCP. However, input signal drivers must comply with the signal quality specifications. 5. This is the pull-down driver resistance. Measured at 0.31*VCCP. RON (min) = 0.38*R TT. R ON (typ) = 0.45*R TT. R ON (max) = 0.52*RTT. 6. GTLREF should be generated from VCCP with a 1% tolerance resistor divider. The VCCP referred to in these specifications is the instantaneous VCCP. 7. RTT is the on-die termination resistance measured at VOL of the AGTL+ output driver. Measured at 0.31*VCCP. RTT is connected to VCCP on-die. 8. Specified with on-die RTT and RON are turned off. Vin (Input Voltage) between 0 and VCCP. 9. Cpad includes die capacitance only. No package parasitics are included. 10. This is the external resistor on the comp pins. 11. On-die termination resistance, measured at 0.33*VCCP. Table 9. AGTL+ Signal Group DC Specifications Symbol Parameter Min Typ Max Unit Notes1 VCCP I/O Voltage 1.00 1.05 1.10 V GTLREF Reference Voltage 2/3 VCCP V6 RCOMP Compensation Resistor 27.23 27.5 27.78 Ω 10 RODT Termination Resistor 55 Ω 11 VIH Input High Voltage GTLREF +0.10 VCCP VCCP +0.10 V 3,6 VIL Input Low Voltage -0.10 0 GTLREF-0.10 V 2,4 VOH Output High Voltage VCCP -0.10 VCCP VCCP 6 R TT Termination Resistance 50 55 61 Ω 7 RON Buffer On Resistance 22 25 28 Ω 5 ILI Input Leakage Current ±100 µA 8 Cpad Pad Capacitance 1.6 2.1 2.55 pF 9 |
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