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L7200 Datasheet(PDF) 40 Page - Intel Corporation |
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L7200 Datasheet(HTML) 40 Page - Intel Corporation |
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40 / 91 page ![]() Package Mechanical Specifications and Pin Information 40 Datasheet Figure 6. 4-MB and 2-MB Fused Micro-FCPGA Processor Package Drawing B6595-01 B H1 H2 G2 G2 J2 J1 478 Pins Bottom View Top View Front View Side View A A Die Underfill Package Substrate ØP 0.65 MAX Ø 0.37 MAX Ø 0.65 MAX 2.03±0.08 C MAX MIN MILLIMETERS COMMENTS SYMBOL B1 B2 C1 C2 B2 B1 C1 C2 F1 F2 F2 F3 G1 G2 H1 H2 J1 J2 15.875 BASIC 15.875 BASIC 31.75 BASIC 31.75 BASIC 1.903 2.163 0.89 34.95 35.05 34.95 35.05 13.8 10.5 1.27 BASIC 1.27 BASIC P 0.355 0.255 P Die 689kPa W 6g Keying Pins A1, B2 Ø0.356 C A Ø0.254 C B Detail A Scale 20 THISDRAWING CONTAINSINTEL CORPORATION CONFIDENTIAL INFORMATION. IT ISDISCLOSED IN CONFIDENCE AND ITS CONTENTS MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION M M |
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