ADG5212/ADG5213

Rev. 0 | Page 9 of 20

PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS

IN2

16

D2

15

S2

14

13

NC

12

S3

11

D3

10

IN3

9

NC = NO CONNECT

ADG5212/

ADG5213

TOP VIEW

(Not to Scale)

Figure 2. TSSOP Pin Configuration

NOTES

2. NC = NO CONNECT.

1

S1

2

3

GND

4

S4

12 S2

10 NC

9S3

TOP VIEW

(Not to Scale)

ADG5212/

ADG5213

Figure 3. LFCSP Pin Configuration

Table 7. Pin Function Descriptions

Pin No.

TSSOP

LFCSP

Mnemonic

Description

1

15

IN1

Logic Control Input.

2

16

D1

Drain Terminal. This pin can be an input or an output.

3

1

S1

Source Terminal. This pin can be an input or an output.

4

2

Most Negative Power Supply Potential.

5

3

GND

Ground (0 V) Reference.

6

4

S4

Source Terminal. This pin can be an input or an output.

7

5

D4

Drain Terminal. This pin can be an input or an output.

8

6

IN4

Logic Control Input.

9

7

IN3

Logic Control Input.

10

8

D3

Drain Terminal. This pin can be an input or an output.

11

9

S3

Source Terminal. This pin can be an input or an output.

12

10

NC

No Connect. These pins are open.

13

11

Most Positive Power Supply Potential.

14

12

S2

Source Terminal. This pin can be an input or an output.

15

13

D2

Drain Terminal. This pin can be an input or an output.

16

14

IN2

Logic Control Input.

N/A1

EP

Exposed pad

Exposed Pad. The exposed pad is connected internally. For increased reliability of the

solder joints and maximum thermal capability, it is recommended that the pad be

Table 8. ADG5212 Truth Table

ADG5212 INx

Switch Condition

1

On

0

Off

Table 9. ADG5213 Truth Table

ADG5213 INx

S1, S4

S2, S3

0

Off

On

1

On

Off