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GS9060 Datasheet(PDF) 18 Page - Gennum Corporation |
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GS9060 Datasheet(HTML) 18 Page - Gennum Corporation |
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18 / 61 page ![]() GS9060 Data Sheet 22208 - 8 January 2007 18 of 61 2.4 Solder Reflow Profiles The device is manufactured with Matte-Sn terminations and is compatible with both standard eutectic and Pb-free solder reflow profiles. The recommended standard eutectic reflow profile is shown in Figure 2-1. MSL qualification was performed using the maximum Pb-free reflow profile shown in Figure 2-2. Figure 2-1: Standard Eutectic Solder Reflow Profile Figure 2-2: Maximum Pb-free Solder Reflow Profile (Pb-free package) 25˚C 100˚C 150˚C 183˚C 230˚C 220˚C Time Temperature 6 min. max 120 sec. max 60-150 sec. 10-20 sec. 3˚C/sec max 6˚C/sec max 25˚C 150˚C 200˚C 217˚C 260˚C 250˚C Time Temperature 8 min. max 60-180 sec. max 60-150 sec. 20-40 sec. 3˚C/sec max 6˚C/sec max |
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