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LPC4350 Datasheet(PDF) 128 Page - NXP Semiconductors |
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LPC4350 Datasheet(HTML) 128 Page - NXP Semiconductors |
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128 / 149 page ![]() LPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved. Objective data sheet Rev. 3.1 — 5 January 2012 128 of 149 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller 13.3 XTAL and RTCX Printed Circuit Board (PCB) layout guidelines Connect the crystal on the PCB as close as possible to the oscillator input and output pins of the chip. Take care that the load capacitors Cx1, Cx2, and Cx3 in case of third overtone crystal usage have a common ground plane. Also connect the external components to the ground plain. To keep the noise coupled in via the PCB as small as possible, make loops and parasitics as small as possible. Choose smaller values of Cx1 and Cx2 if parasitics increase in the PCB layout. 13.4 Standard I/O pin configuration Figure 39 shows the possible pin modes for standard I/O pins with analog input function: • Digital output driver: Open-drain mode enabled/disabled • Digital input: Pull-up enabled/disabled • Digital input: Pull-down enabled/disabled • Digital input: Repeater mode enabled/disabled • Analog input The default configuration for standard I/O pins is input with pull-up enabled. The weak MOS devices provide a drive capability equivalent to pull-up and pull-down resistors. Fig 39. Standard I/O pin configuration with analog input PIN VDD(IO) VDD(IO) ESD VSS ESD strong pull-up strong pull-down VDD(IO) weak pull-up weak pull-down open-drain enable output enable repeater mode enable pull-up enable pull-down enable data output data input analog input select analog input 002aag701 pin configured as digital output driver pin configured as digital input pin configured as analog input |
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