Bonding, Handling, and Mounting Procedures for

Chip Diode Devices

M/A-COM Products

Rev. V3

Application Note

M541

9

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The following precautions will ensure better results when

bonding beam leads:

To minimize the lead inductance, the wedge, or heated

tips should be placed as close as possible to the chip

without touching it. The chip is very easily damaged and

case must be taken that the bonding tip does not contact

the chip at any time during the bonding process.

The bonding tip must be perpendicular to the beam dur-

ing bonding, to prevent a torsional force which will pull

the beams apart. This is particularly important when

bonding the second lead.

Handing and Bonding

The rugged construction of SURMOUNT chip devices

allows the use of standard handling and die attach tech-

niques. It is important to note that industry standard elec-

trostatic discharge (ESD) control is required at all times,

due to the nature of Schottky junctions.

Handing

The devices can be handled with #3c tweezers for man-

ual placement. The top surface of the die has a protec-

tive coating to minimize damage. These devices are

compatible with vacuum pencil or automatic pick and

place installation.

Bonding

Die attach for these devices is made simple through the

use of surface mount die attach technology. Mounting

pads are conveniently located on the bottom surface of

these device and are removed from the active junction

locations. The devices are well suited for high tempera-

ture solder attachment onto hard substrates. The use of

80% gold, 20% tin solder is recommended, but lead tin

solders are acceptable. Conductive epoxy may also be

used for die attach.

When soldering these devices to a hand substrate, hot

gas die bonding is preferred. We recommend utilizing

vacuum tip and force of 60 to 100 grams applied normal

to the top surface of the device. When soldering to soft

substrates, it is recommended to use a lead-tin interface

at the circuit board mounting pads. Position the die so

that its mounting pad are aligned with the circuit board

mounting pads, and reflow the solder by heating the

circuit trace near the mounting pad while applying 60 to

100 grams force perpendicular to the top surface of the

die. Solder reflow must not be accomplished by causing

heat to flow through the die. Consequently, the solder

joints must be made one at a time, or a multi-tip solder-

ing iron could be used to simultaneously reflow all the

solder joints.

Since the HMIC glass is transparent, the edges of the

mounting pads closest to each other can be visually in-

spected through the die after die attach is completed.

Cross Section

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