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LTC4099 Datasheet(PDF) 44 Page - Linear Technology |
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LTC4099 Datasheet(HTML) 44 Page - Linear Technology |
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44 / 52 page ![]() LTC4155 44 4155fc Figure 11. Single-Input Overvoltage Protection Figure 12. Dual-Input Positive and Negative Voltage Protection the drain breakdown voltage rating of MN3 and MN4 and negative protection down to the drain breakdown volt- age rating of MN1 and MN2. Q1 and Q2 are small-signal transistors to protect the gate oxides of MN1 and MN2. Note that it is necessary to orient the N-channel MOSFETs with the drain connections common and the source/body connections to the input connector and the VBUS pin. level, but the inductor current will increase rapidly to the LTC4155’s peak current clamp as incremental inductance tends toward zero. If an overload condition persists with a small inductor, it is possible that the inductor could be damaged by its own resistive temperature rise. The inductor core should be made from a material such as ferrite, suitable for switching at 2.25MHz without excessive hysteretic losses. Table 37 lists several suitable inductors. Table 37. Recommended Inductors MANUFACTURER PART NUMBER RDC (mΩ) IMAX (A) PACKAGE (mm) Vishay IHLP2525AHE-B1ROMO1 17.5 7 6.5 × 6.9 × 3.2 Coilcraft XFL4020-102ME 10.8 5.4 4 × 4 × 2.1 TDK TDKLTF5022T1R2N4R2-LF 21 4.2 5 × 5.2 × 2.2 IMAX is the lower of the typical 30% saturation current and self-heating current specifications. Choosing the Battery Charger MOSFETs The LTC4155 requires a single external P-channel MOS- FET connected between the CHGSNS and BATSNS pins to conduct battery charge and ideal diode currents. The threshold voltage magnitude should be less than approxi- mately 2.5V. (The P-channel threshold might be expressed as a negative number, VGS(th), or as a positive number VSG(th)). Gate leakage current should be below 500nA. Drain voltage breakdown and gate oxide breakdown volt- ages should both be above 5V in magnitude. The LTC4155 contributes approximately 40mΩ resistance in the current sense circuitry in series with the battery charger FET. Channel resistance, RDS(ON), should be small relative to the 40mΩ for maximum efficiency both charging the bat- tery and delivering power from the battery to the system load. Table 38 lists several suitable P-channel transistors. Optionally, a second P-channel MOSFET may be con- nected in series with the first if the application requires that power be cut off from any downstream devices on VOUT in low power ship-and-store mode. Further details about low power ship-and-store mode may be found in the Operation section. The requirements for the second device are the same as those enumerated above, with the caveats that total gate leakage current is the sum of the individual leakage currents and total RDS(ON) is the sum of the individual RDS(ON)s. APPLICATIONS INFORMATION VBUS TO POWER INPUT OVGCAP USBGT USBSNS WALLGT LTC4155 WALLSNS 4155 F11 R1 MN1 VBUS TO USB INPUT TO WALL INPUT OVGCAP USBGT USBSNS WALLGT LTC4155 WALLSNS 4155 F12 MN1 R5 47k R6 47k C1 OPT 0.01μF R3 5M R4 5M R1 3.6k R2 3.6k MN3 MN2 MN4 Q1 Q2 Q3 Q4 Choosing the Inductor The LTC4155 is designed to operate with a 1μH inductor, with core saturation, winding resistance, and thermal rise characteristics appropriate for the application’s peak currents. The inductor current ripple magnitude is ap- proximately 400mA under normal conditions, resulting in a peak inductor current 200mA higher than the aver- age output current of the switching regulator. The aver- age output current of the step-down regulator is higher than the average input current by the ratio VBUS/VOUT, neglecting efficiency losses. The LTC4155 can tolerate transient excursions beyond the inductor’s core saturation |
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