MAX2091 datasheet(2/29 Pages) MAXIM

2 / 29 page

50MHz to 500MHz Analog VGA, 1735MHz to 1935MHz

Upconverting Mixer with Image Filtering, Threshold

Alarm Circuit, and Error Amplifier for Level Control

MAX2091

VCC_A, VCC_IF, VCC_LO, VCC_RF............................-0.3V to +6V

IF_IN, MIX_IN, IF_OUT, LO+, RF_OUT .......-0.3V to VCC + 0.3V

ALM, R_BIAS, DET_VIN, AMP_OUT, LO- ............-0.3V to +3.6V

ALM_THRES, PLVLSET,

CTRL1, CTRL2..........-0.3V to MINIMUM (VCC + 0.3V, +3.6V)

IF_IN, MIX_IN Input Power ........................................... +15dBm

Continuous Power Dissipation (Note 1) ..............................2.5W

Operating Case Temperature

Range (Note 2)............................................... -40NC to +95NC

Maximum Junction Temperature....................................... 150NC

Storage Temperature Range............................ -65NC to +150NC

Lead Temperature (soldering 10s) ...................................300NC

Soldering Temperature (reflow) ......................................+260NC

Junction-to-Ambient Thermal Resistance (

qJA)

(Notes 3, 4)............................................................... +29°C/W

Junction-to-Case Thermal Resistance (

qJC)

(Notes 1, 4)................................................................. +7°C/W

ABSOLUTE MAXIMUM RATINGS

Note 1: Based on junction temperature TJ = TC + (θJC x VCC x ICC). This formula can be used when the temperature of the

exposed pad is known while the device is soldered down to a PCB. See the Applications Information section for details.

The junction temperature must not exceed +150°C.

Note 2: TC is the temperature on the exposed pad of the package. TA is the ambient temperature of the device and PCB.

Note 3: Junction temperature TJ = TA + (θJA x VCC x ICC). This formula can be used when the ambient temperature of the PCB is

known. The junction temperature must not exceed +150N

Note 4: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-

layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-

tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

PACKAGE THERMAL CHARACTERISTICS

DC ELECTRICAL CHARACTERISTICS

(Typical Application Circuit, VCC = 4.75V to 5.8V, VGND = 0V, PLO = -10dBm to -4dBm, and TC = -40°C to +95°C. Typical values are

at VCC = 5.5V, PLO = -7dBm, and TC= +25°C, unless otherwise noted.) (Note 5)

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

Supply Voltage

VCC

4.75

5.5

5.8

Total Supply Current

IDC

CTRL1 = 1, CTRL2 = 1

264

290

CTRL1 = 1, CTRL2 = 0

254

CTRL1 = 0, CTRL2 = 0

8.5

CTRL1/CTRL2 Logic-Low Input Voltage

VIL

0.8

CTRL1/CTRL2 Logic-High Input Voltage

VIH

2.2

CTRL1/CTRL2 Input Logic Current

IIH/IIL

-10

PLVLSET Input Resistance

RIN

650

PLVLSET Input Voltage Range

2.5

PLVLSET Minimum Control Voltage

0.1

0.2

PLVLSET Maximum Control Voltage

2.3

2.4

2.5

DET_IN Input Voltage Range

VIN

2.5

ALM_THRES Input Resistance

135

Alarm Output Logic 1

3.135

3.3

3.465

Alarm Output Logic 0

0.4

DET_VIN Input Resistance

175

235

295

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