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RHF330 Datasheet(PDF) 20 Page - STMicroelectronics |
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RHF330 Datasheet(HTML) 20 Page - STMicroelectronics |
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20 / 22 page ![]() Package information RHF330 20/22 Doc ID 15576 Rev 3 9 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Figure 34. Ceramic Flat-8 package mechanical drawing Table 6. Ceramic Flat-8 package mechanical data Ref. Dimensions Millimeters Inches Min. Typ. Max. Min. Typ. Max. A 2.24 2.44 2.64 0.088 0.096 0.104 b 0.38 0.43 0.48 0.015 0.017 0.019 c 0.10 0.13 0.16 0.004 0.005 0.006 D 6.35 6.48 6.61 0.250 0.255 0.260 E 6.35 6.48 6.61 0.250 0.255 0.260 E2 4.32 4.45 4.58 0.170 0.175 0.180 E3 0.88 1.01 1.14 0.035 0.040 0.045 e 1.27 0.050 L 3.00 0.118 Q 0.66 0.79 0.92 0.026 0.031 0.092 S1 0.92 1.12 1.32 0.036 0.044 0.052 N08 08 |
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