LT3959

23

3959f

PACKAGE DESCRIPTION

Information furnished by Linear Technology Corporation is believed to be accurate and reliable.

However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-

tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.

5.00

± 0.10

6.00

± 0.10

NOTE:

1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE

2. DRAWING NOT TO SCALE

3. ALL DIMENSIONS ARE IN MILLIMETERS

4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE

MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE

PIN 1

TOP MARK

(NOTE 6)

0.40

± 0.10

1

36

35

30

31

32

33 34

28

20

21

23

24

25

27

2

3

4

6

8

9

10

12

13

14

15

16

17

BOTTOM VIEW—EXPOSED PAD

2.00 REF

1.50 REF

0.75

± 0.05

R = 0.125

TYP

R = 0.10

TYP

PIN 1 NOTCH

R = 0.30 OR

0.35

× 45°

CHAMFER

0.25

± 0.05

0.50 BSC

0.200 REF

0.00 – 0.05

(UHE36(28)MA) QFN 0112 REV D

RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS

APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED

0.70

±0.05

4.10

± 0.05

5.50

± 0.05

PACKAGE OUTLINE

1.88

± 0.10

1.53

± 0.10

2.00 REF

1.50 REF

5.10

± 0.05

6.50

± 0.05

UHE Package

Variation: UHE36(28)MA

36(28)-Lead Plastic QFN (5mm

× 6mm)

(Reference LTC DWG # 05-08-1836 Rev D)

3.00

± 0.10

3.00

± 0.10

0.12

± 0.10

1.88

± 0.05

1.53

± 0.05

3.00

± 0.05

3.00

± 0.05

0.48

± 0.05

0.12

± 0.05

0.48

± 0.10

0.25

±0.05

0.50 BSC

10

12

3

4

6

8

9

17

20

21

23

24

25

27

28

30

31

32

33

34

35

36

12

13

14

15

16

5. EXPOSED PAD SHALL BE SOLDER PLATED

6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION

ON THE TOP AND BOTTOM OF PACKAGE