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DS90CF366 Datasheet(PDF) 1 Page - Texas Instruments |
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DS90CF366 Datasheet(HTML) 1 Page - Texas Instruments |
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1 / 20 page ![]() DS90CF366, DS90CF386 www.ti.com SNLS055I – NOVEMBER 1999 – REVISED APRIL 2013 DS90CF386/DS90CF366 +3.3V LVDS Receiver 24-Bit Flat Panel Display (FPD) Link - 85 MHz, +3.3V LVDS Receiver 18-Bit Flat Panel Display (FPD) Link - 85 MHz Check for Samples: DS90CF366, DS90CF386 1 FEATURES DESCRIPTION The DS90CF386 receiver converts the four LVDS • 20 to 85 MHz Shift Clock Support data streams (Up to 2.38 Gbps throughput or 297.5 • Rx Power Consumption <142 mW (typ) Megabytes/sec bandwidth) back into parallel 28 bits @85MHz Grayscale of CMOS/TTL data (24 bits of RGB and 4 bits of • Rx Power-Down Mode <1.44 mW (max) Hsync, Vsync, DE and CNTL). Also available is the DS90CF366 that converts the three LVDS data • ESD Rating >7 kV (HBM), >700V (EIAJ) streams (Up to 1.78 Gbps throughput or 223 • Supports VGA, SVGA, XGA and Single Pixel Megabytes/sec bandwidth) back into parallel 21 bits SXGA. of CMOS/TTL data (18 bits of RGB and 3 bits of • PLL Requires No External Components Hsync, Vsync and DE). Both Receivers' outputs are Falling edge strobe. A Rising edge or Falling edge • Compatible with TIA/EIA-644 LVDS Standard strobe transmitter (DS90C385/DS90C365) will • Low Profile 56-Lead or 48-lead TSSOP interoperate with a Falling edge strobe Receiver Package without any translation logic. • DS90CF386 Also Available in a 64 Ball, 0.8mm The DS90CF386 is also offered in a 64 ball, 0.8mm Fine Pitch Ball Grid Array (NFBGA) Package fine pitch ball grid array (NFBGA) package which provides a 44 % reduction in PCB footprint compared to the 56L TSSOP package. This chipset is an ideal means to solve EMI and cable size problems associated with wide, high speed TTL interfaces. BLOCK DIAGRAM Figure 1. DS90CF386 Figure 2. DS90CF366 See Package Number DGG-56 (TSSOP) or See Package Number DGG-48 (TSSOP) NZC0064A-64 (NFBGA) 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Copyright © 1999–2013, Texas Instruments Incorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. |
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