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AD9649

Rev. 0 | Page 9 of

ABSOLUTE MAXIMUM RATINGS

Table 6.

Parameter

Rating

AVDD to AGND1

−0.3 V to +2.0 V

DRVDD to AGND1

−0.3 V to +3.9 V

VIN+, VIN− to AGND1

−0.3 V to AVDD + 0.2 V

CLK+, CLK− to AGND1

−0.3 V to AVDD + 0.2 V

VREF to AGND1

−0.3 V to AVDD + 0.2 V

SENSE to AGND1

−0.3 V to AVDD + 0.2 V

VCM to AGND1

−0.3 V to AVDD + 0.2 V

RBIAS to AGND1

−0.3 V to AVDD + 0.2 V

CSB to AGND1

−0.3 V to DRVDD + 0.3 V

SCLK/DFS to AGND1

−0.3 V to DRVDD + 0.3 V

SDIO/PDWN to AGND1

−0.3 V to DRVDD + 0.3 V

MODE/OR to AGND1

−0.3 V to DRVDD + 0.3 V

D0 through D13 to AGND1

−0.3 V to DRVDD + 0.3 V

DCO to AGND1

−0.3 V to DRVDD + 0.3 V

Operating Temperature Range (Ambient)

−40°C to +85°C

Maximum Junction Temperature Under Bias

150°C

Storage Temperature Range (Ambient)

−65°C to +150°C

1 AGND refers to the analog ground of the customer’s PCB.

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL CHARACTERISTICS

The exposed paddle is the only ground connection for the chip

and must be soldered to the analog ground plane of the user’s

PCB. Soldering the exposed paddle to the user’s board also

increases the reliability of the solder joints and maximizes the

thermal capability of the package.

Table 7. Thermal Resistance

Package

Type

Airflow

Velocity

(m/sec)

θJA1, 2

θJC1, 3

θJB1, 4

1,2

Unit

32-Lead LFCSP

5 mm × 5 mm

37.1

3.1

20.7

0.3

°C/W

1.0

32.4

0.5

°C/W

2.5

29.1

0.8

°C/W

1 Per JEDEC 51-7, plus JEDEC 51-5 2S2P test board.

2 Per JEDEC JESD51-2 (still air) or JEDEC JESD51-6 (moving air).

3 Per MIL-Std 883, Method 1012.1.

4 Per JEDEC JESD51-8 (still air).

Typical θJA is specified for a 4-layer PCB with a solid ground

plane. As shown in Table 7, airflow improves heat dissipation,

which reduces θJA. In addition, metal in direct contact with the

package leads from metal traces, through holes, ground, and

power planes, reduces the θJA.

ESD CAUTION

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