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DAC80P Datasheet(PDF) 3 Page - Texas Instruments

Part # DAC80P
Description  Monolithic 12-Bit DIGITAL-TO-ANALOG CONVERTERS
PDF  10 Pages
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

DAC80P Datasheet(HTML) 3 Page - Texas Instruments

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DAC80/80P
®
FUNCTIONAL DIAGRAM AND PIN ASSIGNMENTS
ABSOLUTE MAXIMUM RATINGS
PACKAGE INFORMATION
NOTE: (1) For detailed drawing and dimension table, please see end of data
sheet, or Appendix D of Burr-Brown IC Data Book.
PACKAGE DRAWING
MODEL
PACKAGE
NUMBER(1)
DAC80P
24-Pin Plastic DIP
167
DAC80
24-Pin Ceramic DIP
125
+V
CC to Common ...................................................................... 0V to +18V
–V
CC to Common ......................................................................... 0V to –18
Digital Data Inputs to Common .............................................. –1V to +18V
Reference Output to Common ............................................................
±V
CC
Reference Input to Common ...............................................................
±V
CC
Bipolar Offset to Common ...................................................................
±V
CC
10V Range R to Common ...................................................................
±V
CC
20V Range R to Common ...................................................................
±V
CC
External Voltage to DAC Output .............................................. –5V to +5V
Lead Temperature (soldering, 10s) ................................................ +300
°C
Max Junction Temperature .............................................................. 165
°C
Thermal Resistance,
θ
JA: Plastic DIP ........................................... 100°C/W
Ceramic DIP ......................................... 65
°C/W
Stresses above those listed under “Absolute Maximum Ratings” may
cause permanent damage to the device. Exposure to absolute maxi-
mum conditions for extended periods may affect device reliability.
NOTE: (1) Logic supply applied to this pin has no effect.
(MSB) Bit 1
Bit 2
Bit 3
Bit 4
Bit 5
Bit 6
Bit 7
Bit 8
Bit 9
Bit 10
Bit 11
(LSB) Bit 12
6.3V Ref Out
Gain Adjust
+V
CC
Common
Summing Junction
20V Range
10V Range
Bipolar Offset
Ref Input
V
OUT
–V
CC
NC(1)
1
2
3
4
5
6
7
8
9
10
11
12
24
23
22
21
20
19
18
17
16
15
14
13
Reference
Control
Circuit
12-Bit
Resistor
Ladder
Network
and
Current
Switches
(MSB) Bit 1
Bit 2
Bit 3
Bit 4
Bit 5
Bit 6
Bit 7
Bit 8
Bit 9
Bit 10
Bit 11
(LSB) Bit 12
6.3V Ref Out
Gain Adjust
+V
CC
Common
Scaling Network
Scaling Network
Scaling Network
Bipolar Offset
Ref Input
I
OUT
–V
CC
NC(1)
1
2
3
4
5
6
7
8
9
10
11
12
24
23
22
21
20
19
18
17
16
15
14
13
Reference
Control
Circuit
12-Bit
Resistor
Ladder
Network
and
Current
Switches
Voltage Models
Current Models
5k
Ω
5k
Ω
6.3k
Ω
2k
Ω
3k
Ω
6.3k
Ω
5k
Ω
BURN-IN SCREENING
Burn-in screening is an option available for the models
indicated in the Ordering Information table. Burn-in dura-
tion is 160 hours at the maximum specified grade operating
temperature (or equivalent combination of time and tem-
perature).
All units are tested after burn-in to ensure that grade speci-
fications are met. To order burn-in, add “–BI” to the base
model number.
ORDERING INFORMATION
MODEL
PACKAGE
OUTPUT
DAC80-CBI-I
Ceramic DIP
Current
DAC80Z-CBI-I
Ceramic DIP
Current
DAC80-CBI-V
Ceramic DIP
Voltage
DAC80Z-CBI-V
Ceramic DIP
Voltage
DAC80P-CBI-V
Plastic DIP
Voltage
BURN-IN SCREENING OPTION
BURN-IN TEMP.
MODEL
PACKAGE
(160h)(1)
DAC80-CBI-V-BI
Ceramic DIP
+125
°C
DAC80P-CBI-V-BI
Plastic DIP
+125
°C
NOTE: (1) Or equivalent combination. See text.



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