TMS320DM6467 datasheet(81/355 Pages) TI

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PREFIX

TMS

320

DM6467

CUT

TMX = Experimental device

TMS = Qualified device

DEVICE FAMILY

320 = TMS320™ DSP family

PACKAGE TYPE

(A)

C64x+™ DSP:

DM6467

DEVICE

DEVICE SPEED RANGE

( )

Blank = 594-MHz DSP, 297-MHz ARM9

[Default]

7 = 729-MHz DSP, 364.5-MHz ARM9

, 297-MHz DDR2

, 310.5-MHz DDR2

TEMPERATURE RANGE

SILICON REVISION

Blank =

A = -4

0° C to 85° C, Commercial Temperature

0° C to 105° C, Extended Temperature [-594 MHz only]

D = -40° C to 85° C, Industrial Temperature [-729 MHz only]

VOLTAGE SCALE ADJUSTMENT

Blank =

V = SmartReflex [-594 MHz only]

SmartReflex Not Supported

TMX

TMS

CUT = 529-pin plastic BGA, with Pb-Free die bump and

solder ball

Blank =

C =

Revision 1.1

Revision 3.0

Blank =

C =

Revision 1.0

A = Revision 1.1

Revision 3.0

TMS320DM6467

www.ti.com

SPRS403H – DECEMBER 2007 – REVISED JUNE 2012

Predictions show that prototype devices (TMX or TMP) have a greater failure rate than the standard

production devices. Texas Instruments recommends that these devices not be used in any production

system because their expected end-use failure rate still is undefined. Only qualified production devices are

to be used.

TI device nomenclature also includes a suffix with the device family name. This suffix indicates the

package type (for example, CUT), the temperature range (for example, "Blank" is the commercial

temperature range), and the device speed range in megahertz (for example, "Blank" is the default [594-

MHz DSP, 297-MHz ARM9]).

Figure 3-8 provides a legend for reading the complete device name for any TMS320DM646x DMSoC

platform member.

BGA = Ball Grid Array

For actual device part numbers (P/Ns) and ordering information, see the TI website (http://www.ti.com).

Figure 3-8. Device Nomenclature(B)

Device Overview

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TMS320DM6467 Datasheet(PDF) 81 Page - Texas Instruments

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