ADS1278IPAPR datasheet(41/51 Pages) TI1

41 / 51 page

13mils(0.33mm)

Package

ThermalPad

Component

Traces

ThermalVia

Component(top)Side

GroundPlane

PowerPlane

Solder(bottom)Side

ThermalIsolation

(powerplaneonly)

Package

ThermalPad

(bottomtrace)

ADS1274

ADS1278

www.ti.com

SBAS367F

– JUNE 2007 – REVISED FEBRUARY 2011

PowerPAD PCB Layout Considerations

The via connections to the thermal pad and internal

ground plane should be plated completely around the

Figure 92 shows the recommended layer structure for

hole, as opposed to the typical web or spoke thermal

thermal

management

when

using

PowerPad

relief connection. Plating entirely around the thermal

package on a 4-layer PCB design. Note that the

via provides the most efficient thermal connection to

thermal pad is placed on both the top and bottom

the ground plane.

sides of the board. The ground plane is used as the

heatsink, while the power plane is thermally isolated

Additional PowerPAD Package Information

from the thermal vias.

Texas

Instruments

publishes

the

PowerPAD

Figure 93 shows the required thermal pad etch

Thermally Enhanced Package Application Report (TI

pattern for the HTQFP-64 package used for the

literature number SLMA002), available for download

ADS1274. Nine 13mil (0.33mm) thermal vias plated

www.ti.com,

that

provides

detailed

with 1 ounce of copper are placed within the thermal

discussion

PowerPAD

design

and

layout

pad area for the purpose of connecting the pad to the

considerations. Before attempting a board layout with

ground plane layer. The ground plane is used as a

the ADS1274, it is recommended that the hardware

heatsink in this application. It is very important that

engineer and/or layout designer be familiar with the

the thermal via diameter be no larger than 13mils in

information contained in this document.

order to avoid solder wicking during the reflow

process. Solder wicking results in thermal voids that

reduce heat dissipation efficiency and hampers heat

flow away from the IC die.

Figure 92. Recommended PCB Structure for a 4-Layer Board

Submit Documentation Feedback

Product Folder Link(s): ADS1274 ADS1278

ADS1278IPAPR Datasheet(PDF) 41 Page - Texas Instruments

ADS1278IPAPR Datasheet(HTML) 41 Page - Texas Instruments

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51

Datasheet Download

Link URL