AD9726-EBZ datasheet(8/24 Pages) AD

8 / 24 page

AD9726

Rev. B | Page 8 of 24

ABSOLUTE MAXIMUM RATINGS

Table 5.

THERMAL RESISTANCE

Parameter

With Respect to

Rating

DBVDD, AVDD1,

AVDD2

DBGND, AGND1,

AGND2

−0.3 V to 3.6 V

DVDD, CLKVDD,

ACVDD, ADVDD

DGND, CLKGND,

ACGND, ADGND

−0.3 V to 2.8 V

DBGND, AGND1,

AGND2

DBGND, AGND1,

AGND2

−0.3 V to +0.3 V

DGND, CLKGND,

ACGND, ADGND

DGND, CLKGND,

ACGND, ADGND

−0.3 V to +0.3 V

REFIO, FSDAJ

AGND1

−0.3 V to AVDD1

+ 0.3 V

IOUTA, IOUTB

AGND1

−1.0 V to AVDD1

+ 0.3 V

CLK±

CLKGND

−0.3 V to CLKVDD

+ 0.3 V

DB[15:0]±,

DCLK_IN±,

DCLK_OUT±

DBGND

−0.3 V to DBVDD

+ 0.3 V

CSB, SCLK, SDIO,

SDO, RESET, REXT

DBGND

−0.3 V to DBVDD

+ 0.3 V

SDR_EN, SPI_DIS

ADGND

−0.3 V to ADVDD

+ 0.3 V

Thermal impedance can be lowered to 23°C/W by soldering the

exposed package pad to an external heat sink (for example, the

internal PCB copper ground plane). However, this is not necessary

for the power dissipation and operating temperature range of

the AD9726.

Table 6. Thermal Resistance

Package Type

θJA

Unit

80-Lead TQFP_EP Package, Thermally Enhanced

°C/W

ESD CAUTION

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

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