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DS5002FP Datasheet(PDF) 8 Page - Dallas Semiconductor

Part # DS5002FP
Description  Secure Microprocessor Chip
PDF  25 Pages
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Manufacturer  DALLAS [Dallas Semiconductor]
Direct Link  https://www.maximintegrated.com/en.html
Logo DALLAS - Dallas Semiconductor

DS5002FP Datasheet(HTML) 8 Page - Dallas Semiconductor

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DS5002FP Secure Microprocessor Chip
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AC CHARACTERISTICS—BYTE-WIDE ADDRESS/DATA BUS TIMING
(VCC = 5V ±10%, TA = 0°C to +70°C.) (Figure 6)
#
PARAMETER
SYMBOL
MIN
MAX
UNITS
40
Delay to Byte-Wide Address Valid from
CE1,
CE2, or CE1N Low During Op Code Fetch
tCE1LPA
30
ns
41
Pulse Width of
CE1–4, PE1–4, or CE1N
tCEPW
4tCLK - 35
ns
42
Byte-Wide Address Hold After
CE1, CE2, or
CE1N High During Op Code Fetch
tCE1HPA
2tCLK - 20
ns
43
Byte-Wide Data Setup to
CE1, CE2, or CE1N
High During Op Code Fetch
tOVCE1H
1tCLK + 40
ns
44
Byte-Wide Data Hold After
CE1, CE2, or CE1N
High During Op Code Fetch
tCE1HOV
0
ns
45
Byte-Wide Address Hold After
CE1–4, PE1–4, or
CE1N High During MOVX
tCEHDA
4tCLK - 30
ns
46
Delay from Byte-Wide Address Valid
CE1–4,
PE1–4, or CE1N Low During MOVX
tCELDA
4tCLK - 35
ns
47
Byte-Wide Data Setup to
CE1–4, PE1–4, or
CE1N High During MOVX (Read)
tDACEH
1tCLK + 40
ns
48
Byte-Wide Data Hold After
CE1–4, PE1–4, or
CE1N High During MOVX (Read)
tCEHDV
0
ns
49
Byte-Wide Address Valid to R/
W Active During
MOVX (Write)
tAVRWL
3tCLK - 35
ns
50
Delay from R/
W Low to Valid Data Out During
MOVX (Write)
tRWLDV
20
ns
51
Valid Data Out Hold Time from
CE1–4, PE1–4, or
CE1N High
tCEHDV
1tCLK - 15
ns
52
Valid Data Out Hold Time from R/
W High
tRWHDV
0
ns
53
Write Pulse Width (R/
W Low Time)
tRWLPW
6tCLK - 20
ns
Figure 6. Byte-Wide Bus Timing



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