139

Packaged Thermal Cutoffs

Therm-O-Disc also offers a variety of packaging options for MICROTEMP

Therm-O-Disc offers two standard packages with wide application in the HVAC industry. Primarily

designed for heating applications, the GXAM04 and GXAM06 packages mount a standard G4 or

G5 TCO in a high temperature ceramic base (see figure 5).

The popular GXAP Potted TCO packages consist of a TCO epoxy-potted into a plastic insulating

mounting case. The assembly can be supplied with various case materials, shapes and terminations.

They can be used to accurately sense temperature as probes and as surface, airstream and ambient

sensors (see figure 6). They can be easily replaced in the field without disturbing the rest of the circuit.

Custom packages, insulations or special assemblies may be specified to meet specific unique

application needs. By taking advantage of our technical expertise and high volume production

methods and equipment, we can provide significant savings on custom packages.

Packaged TCO Material Specifications

Figure 5

Figure 6

GXAM04

GXAM06

GXAP04

GXAP02

GXAP12

GXAP05

GXAP08

Type

Base Material

Material Rating

Maximum TCO

Temperature °C

Temperature °C

GXAP01

Valox DR48

120

128

GXAP02

Ryton R-4

220

152

GXAP04

Valox DR48

120

128

GXAP05

Valox DR48

120

128

GXAP08

Ryton R-7

220

184

GXAP10

Ryton R-7

220

184

GXAP12

Valox DR48

120

128

GXAM04

Ceramic DIN VDE 0335, C 221

>250

240

GXAM06

Ceramic DIN VDE 0335, C 221

>250

240