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LM3203 Datasheet(PDF) 3 Page - Texas Instruments

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Part # LM3203
Description  Step-Down DC-DC Converter with Bypass Mode for CDMA / WCDMA RF Power Amplifiers
PDF  23 Pages
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

LM3203 Datasheet(HTML) 3 Page - Texas Instruments

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LM3203
www.ti.com
SNVS355C – MAY 2005 – REVISED JULY 2005
Table 1. Pin Description 4.7µF for COUT and 10µF for CIN
Pin #
Name
Description
A1
VDD
Analog Supply Input. A 0.1 µF ceramic capacitor is recommended to be placed as close to this pin as
possible. (Figure 3)
B1
VCON
Voltage Control Analog input. VCON controls VOUT in PWM mode. (Refer to Setting the Output Voltage) Do not
leave floating.
C1
FB
Feedback Analog Input. Connect to the external resistor divider. (Figure 3)
D1
BYP
Bypass. Use this digital input to command operation in Bypass mode. Set BYP low for PWM operation.
D2
EN
Enable Input. Set this digital input high after Vin >2.7V for normal operation. For shutdown, set low.
D3
PGND
Power Ground
C3
SW
Switching Node connection to the internal PFET switch and NFET synchronous rectifier.
Connect to an inductor with a saturation current rating that exceeds the maximum Switch Peak Current Limit
specification of the LM3203.
B3
PVIN
Power Supply Voltage Input to the internal PFET switch and Bypass FET. (Figure 3)
A3
BYPOUT
Bypass FET Drain. Connect to the output capacitor. (Figure 3) Connect this pin to VDD when Bypass mode is
NOT required. Do not leave floating.
A2
SGND
Analog and Control Ground
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings
(1) (2) 4.7µF for C
OUT and 10µF for CIN
VDD, PVIN to SGND
−0.2V to +6.0V
PGND to SGND
−0.2V to +0.2V
EN, FB, BYP, VCON
(SGND
−0.2V)
to (VDD +0.2V)
w/6.0V max
SW, BYPOUT
(PGND
−0.2V)
to (PVIN +0.2V)
w/6.0V max
PVIN to VDD
−0.2V to +0.2V
Continuous Power Dissipation(3)
Internally Limited
Junction Temperature (TJ-MAX)
+150°C
Storage Temperature Range
−65°C to +150°C
Maximum Lead Temperature
(Soldering, 10 sec)
+260°C
ESD Rating (4)
Human Body Model
2.0 kV
(1)
Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under
which operation of the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed
performance limits and associated test conditions, see the Electrical Characteristics table.
(2)
All voltages are with respect to the potential at the GND pins.
(3)
Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ = 150°C (typ.) and
disengages at TJ = 130°C (typ.).
(4)
The Human body model is a 100pF capacitor discharged through a 1.5k
Ω resistor into each pin. (MIL-STD-883 3015.7) . National
Semiconductor recommends that all integrated circuits be handled with appropriate precautions.
Operating Ratings
(1) (2) 4.7µF for C
OUT and 10µF for CIN
Input Voltage Range
2.7V to 5.5V
Recommended Load Current
PWM Mode
0mA to 500mA
Bypass Mode
0mA to 500mA
(1)
Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under
which operation of the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed
performance limits and associated test conditions, see the Electrical Characteristics table.
(2)
All voltages are with respect to the potential at the GND pins.
Copyright © 2005, Texas Instruments Incorporated
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