LM3203 datasheet(4/23 Pages) TI1

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LM3203

SNVS355C – MAY 2005 – REVISED JULY 2005

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Operating Ratings

(1)(2) 4.7µF for C

OUT and 10µF for CIN

(continued)

Junction Temperature (TJ) Range

−30°C to +125°C

Ambient Temperature (TA) Range

(3)

−30°C to +85°C

(3)

In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may

have to be de-rated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP =

125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the

part/package in the application (

θJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (θJA × PD-MAX).

Thermal Properties 4.7µF for COUT and 10µF for CIN

Junction-to-Ambient Thermal

100°C/W

Resistance (

θJA), TLP10 Package

(1)

Junction-to-ambient thermal resistance (

θJA) is taken from thermal measurements, performed under the conditions and guidelines set

forth in the JEDEC standard JESD51-2. A 1" x 1", 4 layer, 1.5oz. Cu board was used for the measurements.

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