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LP5526 Datasheet(PDF) 5 Page - Texas Instruments |
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LP5526 Datasheet(HTML) 5 Page - Texas Instruments |
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5 / 39 page ![]() LP5526 www.ti.com SNVS431C – FEBRUARY 2006 – REVISED JULY 2009 Thermal Properties Junction-to-Ambient Thermal Resistance( θJA), TLA25 Package (1) 60 - 100ºC/W (1) Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power dissipation exists, special care must be paid to thermal dissipation issues in board design. Copyright © 2006–2009, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Links: LP5526 |
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