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80960JD Datasheet(PDF) 24 Page - Intel Corporation

Part # 80960JD
Description  EMBEDDED 32-BIT MICROPROCESSOR
PDF  61 Pages
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Manufacturer  INTEL [Intel Corporation]
Direct Link  http://www.intel.com
Logo INTEL - Intel Corporation

80960JD Datasheet(HTML) 24 Page - Intel Corporation

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80960JD
20
PRELIMINARY
3.2
Package Thermal Specifications
The 80960JD is specified for operation when T
C
(case temperature) is within the range of 0°C to 85°C
for the (PGA) 80960JD-50, or 0°C to 100°C for the
(PQFP and PGA) 80960JD-40 and 80960JD-33.
Case
temperature
may
be
measured
in
any
environment to determine whether the 80960JD is
within specified operating range. The case temper-
ature should be measured at the center of the top
surface, opposite the pins.
θ
CA is the thermal resistance from case to ambient.
Use the following equation to calculate TA, the
maximum ambient temperature to conform to a
particular case temperature:
TA = TC - P (θCA)
Junction temperature (T
J)
is commonly used in
reliability calculations. T
J can be calculated from θJC
(thermal resistance from junction to case) using the
following equation:
T
J = TC + P (θJC)
Similarly, if TA is known, the corresponding case
temperature (TC) can be calculated as follows:
TC = TA + P (θCA)
Compute P by multiplying I
CC from Table 14 and
V
CC. Values for θJC and θCA are given in Table 10 for
the PGA package and Table 11 for the PQFP
package. For high speed operation, the processor’s
θ
JA
may be significantly reduced by adding a
heatsink and/or by increasing airflow.
Figure 6 shows the maximum ambient temperature
(TA) permitted without exceeding TC for the
80960JD-50 in a PGA package. Figure 7 illustrates
this
for
the
80960JD-40
in
PGA
and
PQFP
packages. The curves are based on minimum ICC
(hot) and maximum VCC of +5.25 V, with a TCASE of
+85°C for the 80960JD-50, or a TCASE of +100°C for
the 80960JD-40.
Table 10. 132-Lead PGA Package Thermal Characteristics
Thermal Resistance — °C/Watt
Parameter
Airflow — ft./min (m/sec)
0
(0)
200
(1.01)
400
(2.03)
600
(3.04)
800
(4.06)
1000
(5.08)
θ
JC (Junction-to-Case)
3
3
3
3
3
3
θ
CA (Case-to-Ambient) (No Heatsink)
18
15
12
11
11
11
θ
CA (Case-to-Ambient) (Omnidirectional Heatsink)
15
12
9
8
8
8
θ
CA (Case-to-Ambient) (Unidirectional Heatsink)
14
11
8
7
7
7
NOTES:
1. This table applies to a PGA device plugged into a socket or soldered directly into a board.
2.
θ
JA = θJC + θCA
3.
θ
J-CAP = 4°C/W (approx.)
4.
θ
J-PIN = 4°C/W (inner pins) (approx.)
5.
θ
J-PIN = 8°C/W (outer pins) (approx.)
θ
JC
θ
JA
θ
J-CAP
θ
CA
θ
J-PIN



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