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80960JD Datasheet(PDF) 24 Page - Intel Corporation |
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80960JD Datasheet(HTML) 24 Page - Intel Corporation |
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24 / 61 page ![]() 80960JD 20 PRELIMINARY 3.2 Package Thermal Specifications The 80960JD is specified for operation when T C (case temperature) is within the range of 0°C to 85°C for the (PGA) 80960JD-50, or 0°C to 100°C for the (PQFP and PGA) 80960JD-40 and 80960JD-33. Case temperature may be measured in any environment to determine whether the 80960JD is within specified operating range. The case temper- ature should be measured at the center of the top surface, opposite the pins. θ CA is the thermal resistance from case to ambient. Use the following equation to calculate TA, the maximum ambient temperature to conform to a particular case temperature: TA = TC - P (θCA) Junction temperature (T J) is commonly used in reliability calculations. T J can be calculated from θJC (thermal resistance from junction to case) using the following equation: T J = TC + P (θJC) Similarly, if TA is known, the corresponding case temperature (TC) can be calculated as follows: TC = TA + P (θCA) Compute P by multiplying I CC from Table 14 and V CC. Values for θJC and θCA are given in Table 10 for the PGA package and Table 11 for the PQFP package. For high speed operation, the processor’s θ JA may be significantly reduced by adding a heatsink and/or by increasing airflow. Figure 6 shows the maximum ambient temperature (TA) permitted without exceeding TC for the 80960JD-50 in a PGA package. Figure 7 illustrates this for the 80960JD-40 in PGA and PQFP packages. The curves are based on minimum ICC (hot) and maximum VCC of +5.25 V, with a TCASE of +85°C for the 80960JD-50, or a TCASE of +100°C for the 80960JD-40. Table 10. 132-Lead PGA Package Thermal Characteristics Thermal Resistance — °C/Watt Parameter Airflow — ft./min (m/sec) 0 (0) 200 (1.01) 400 (2.03) 600 (3.04) 800 (4.06) 1000 (5.08) θ JC (Junction-to-Case) 3 3 3 3 3 3 θ CA (Case-to-Ambient) (No Heatsink) 18 15 12 11 11 11 θ CA (Case-to-Ambient) (Omnidirectional Heatsink) 15 12 9 8 8 8 θ CA (Case-to-Ambient) (Unidirectional Heatsink) 14 11 8 7 7 7 NOTES: 1. This table applies to a PGA device plugged into a socket or soldered directly into a board. 2. θ JA = θJC + θCA 3. θ J-CAP = 4°C/W (approx.) 4. θ J-PIN = 4°C/W (inner pins) (approx.) 5. θ J-PIN = 8°C/W (outer pins) (approx.) θ JC θ JA θ J-CAP θ CA θ J-PIN |
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