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80960JD Datasheet(PDF) 25 Page - Intel Corporation |
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80960JD Datasheet(HTML) 25 Page - Intel Corporation |
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25 / 61 page  PRELIMINARY 21 80960JD Figure 6. 50 MHz Maximum Allowable Ambient Temperature Table 11. 132-Lead PQFP Package Thermal Characteristics Thermal Resistance — °C/Watt Parameter Airflow — ft./min (m/sec) 0 (0) 50 (0.25) 100 (0.50) 200 (1.01) 400 (2.03) 600 (3.04) 800 (4.06) θ JC (Junction-to-Case) 6 7 7 7 7 7 7 θ CA (Case-to-Ambient -No Heatsink) 23 20 18 14 10 9 8 NOTES: 1. This table applies to a PQFP device soldered directly into board. 2. θ JA = θJC + θCA 3. θ JL = 18°C/W (approx.) 4. θJB = 18°C/W (approx.) θ JB θ JA θ JC θ JL θ CA AIRFLOW (ft/min) 65 60 55 50 45 40 35 30 0 100 200 300 400 500 600 700 800 PGA with no heatsink PGA with omnidirectional heatsink PGA with unidirectional heatsink |
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