11

µµµµµPC2723T

NOTE ON CORRECT USE

(1)

Observe precautions for handling because of electro-static sensitive devices.

(2)

Form a ground pattern as wide as possible to minimize ground impedance (to prevent undesired oscillation).

(3)

Keep the wiring length of the ground pins as short as possible.

(4)

RECOMMENDED SOLDERING CONDITIONS

This product should be soldered in the following recommended conditions. Other soldering methods and conditions than

the recommended conditions are to be consulted with our sales representatives.

µPC2723T

Soldering method

Infrared ray reflow

VPS

Wave soldering

Pin part heating

Soldering conditions

Package peak temperature: 235

°C,

Hour: within 30 s. (more than 210

°C),

Time: 2 times, Limited days: no.*

Package peak temperature: 215

°C,

Hour: within 40 s. (more than 200

°C),

Time: 2 times, Limited days: no.*

Soldering tub temperature: less than 260

°C,

Hour: within 10 s.

Time: 1 time, Limited days: no.

Pin area temperature: less than 300

°C,

Hour: within 3 s/pin.

Limited days: no.*

Recommended

condition symbol

IR35–00-2

VP15–00-2

WS60–00-1

*: It is the storage days after opening a dry pack, the storage conditions are 25

°C, less than 65 % RH.

Note 1. The combined use of soldering method is to be avoided (However, except the pin area heating method).

For details of recommended soldering conditions for surface mounting, refer to information document

SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (IEI-1207).