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UM1693 Datasheet(PDF) 25 Page - STMicroelectronics

Part # UM1693
Description  M0-7 standard high-side drivers hardware design guide
PDF  196 Pages
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

UM1693 Datasheet(HTML) 25 Page - STMicroelectronics

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UM1693
Reverse battery protection
195
A voltage drop of RDS(on) × ISON is seen in the ground return path when using the N-MOS
FET. A voltage drop of RDS(on) × ILOAD is seen in the power path when using the PMOS
FET. In the past, the primary disadvantage of these circuits has been the high cost of low
RDS(on), low-threshold voltage FETs. However, advances in semiconductor processing have
resulted in FETs that provide minimal drops in small packages.
The N-channel MOSFET is connected in such a way, that its gate is driven directly by the
battery voltage and its drain is connected to ground. In normal condition it is ON whilst a
reverse battery event switches it OFF (because VGS ≤ 0) and protects the HSD.
In Figure 8 is reported a generic schematic with N-channel MOSFET configuration. In this
case, like for the solution with Diode || Resistor network in the GND line, the HSD´s output
stage body diode is forward biased and therefore is conducting during the reverse battery.
The current is limited by the external load. Since no thermal protection works in reverse
condition, special care must be taken on the total power dissipation in the device. During the
reverse battery event, the peak junction temperature shall remain safely below the
maximum allowed junction temperature (TTSD_max). Considering a voltage drop on the
internal body diode of VF_max = 0.7 V, the resulting power dissipation in the HSD per output
channel is PD = 0.7 V · ILOAD.
Zthj-a diagrams reported in HSD datasheets help the user to calculate the maximum
affordable load current for a given PCB layout.



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