AN2839 datasheet(23/40 Pages) STMICROELECTRONICS

23 / 40 page

AN2839

Designing an application with L6228

Doc ID 15104 Rev 1

23/40

1.13.1

Maximum output current versus selectable devices

Figure 26 shows a performance comparison between the L6228 (standard power) and the

L6208 (high power) for different packages, with the following assumptions.

●

Normal drive mode (two-phase on).

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Supply voltage: 24 V; switching frequency: 30 kHz.

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Tamb = 25° C, TJ = 125° C.

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Maximum RDS(on) (taking into account the process spread) considered, at

125° C.

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Maximum quiescent current IQ (taking into account the process spread) considered.

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PCB is an FR4 with a dissipating copper surface on the top side of 6 cm2 (with a

thickness of 35 µm) for SO and PowerDIP packages (D, N suffixes).

●

PCB is an FR4 with a dissipating copper surface on the top side of 6 cm2 (with a

thickness of 35 µm), 16 via holes and a ground layer for the PowerSO package

(PD suffix).

For each device (on the x axis), the y axis reports the maximum output current.

Figure 26.

Maximum output current vs. selectable devices

1.13.2

Power dissipation and thermal analysis with PractiSPINTM software

The PractiSPINTM software includes a power dissipation and thermal analysis section that

helps to calculate the IC power dissipation and estimate its junction temperature through a

simulation.

The purpose of this section is to help perform a quick evaluation of the device, package and

dissipating copper area required by the user’s application, and is a good starting point when

designing an application (from the power dissipation and thermal points of view). Software

results, especially thermal results, need to be confirmed on-bench.

AN2839 Datasheet(PDF) 23 Page - STMicroelectronics