UPD75402ACT datasheet(42/48 Pages) NEC

42 / 48 page

µPD75402A(A)

12. RECOMMENDED SOLDERING CONDITIONS

The following conditions shall be met when soldering the

µPD75402A(A).

For details of the recommended soldering conditions, refer to our document "SMD Surface Mount

Technology Manual" (IEI-1207).

Please consult with our sales offices in case other soldering process is used, or in case soldering is done

under different conditions.

Table 12-1 Soldering Conditions for Surface-Mount Devices

µPD75402AGB(A)-×××-3B4: 44-pin plastic QFP (10 × 10 mm)

Caution Do not apply more than a single process at once, except for “Partial heating method.”

Table 12-2 Soldering Conditions for Insertion-Mount Devices

µPD75402AC(A)-×××: 28-pin plastic DIP (600 mil)

µPD75402ACT(A)-×××: 28-pin plastic shrink DIP (400 mil)

Caution In wave soldering, apply solder only to the lead section. Care must be taken that jet solder does

not come in contact with the main body of the package.

Solder temperature: 260 ˚C or less

Flow time: 10 seconds or less

Terminal temperature: 260 ˚C or less

Flow time: 10 seconds or less

Wave soldering

(Only for leads)

Partial heating method

Soldering process

Soldering conditions

Peak package’s surface temperature: 230 ˚C

Reflow time: 30 seconds or less (210 ˚C or more)

Number of reflow processes: 1

Peak package’s surface temperature: 215 ˚C

Reflow time: 40 seconds or less (200 ˚C or more)

Number of reflow processes: 1

Solder temperature: 260 ˚C or less

Flow time: 10 seconds or less

Number of flow processes: 1

Preheating temperature: 120 ˚C max. (measured on the package

surface)

Terminal temperature: 300 ˚C or less

Flow time: 3 seconds or less (for each side of device)

Soldering process

Infrared ray reflow

VPS

Wave soldering

Partial heating method

Symbol

IR30-00-1

VP15-00-1

WS60-00-1

—

Soldering conditions

Notice

Other versions of the products are available. For these versions, the recommended reflow

soldering conditions have been mitigated as follows:

Higher peak temperature (235

°C), two-stage, and longer exposure limit.

Contact an NEC representative for details.

UPD75402ACT Datasheet(PDF) 42 Page - NEC

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