µµµµµPG133G

10

RECOMMENDED SOLDERING CONDITIONS

This product should be soldered in the following recommended conditions. Other soldering methods and conditions

than the recommended conditions are to be consulted with our sales representatives.

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µµµµµPG133G]

Soldering process

Soldering conditions

Recommended condition

symbol

Infrared ray reflow

Package peak temperature: 230 ˚C

IR30-00-2

Hour: within 30 s. (more than 210 ˚C)

VPS

Package peak temperature: 215 ˚C

VP15-00-2

Hour: within 40 s. (more than 200 ˚C),

Wave Soldering

Soldering tub temperature: less than 260 ˚C, Hour: within 10 s.

WS60-00-1

Pin part heating

Pin area temperature: less than 300 ˚C, Hour: within 10 s.

Note It is storage days after opening a dry pack, the storage conditions are 25 ˚C, less than 65 %, RH.

Caution The combined use of soldering method is to be avoided (However, except the pin area heating

method).