DM385 datasheet(259/281 Pages) TI

259 / 281 page

DM385, DM388

www.ti.com

SPRS821D – MARCH 2013 – REVISED DECEMBER 2013

8.16.3.2.1 Coupling Capacitors

AC coupling capacitors are required on the transmit data pair. Table 8-76 shows the requirements for

these capacitors.

Table 8-76. AC Coupling Capacitors Requirements

PARAMETER

MIN

TYP

MAX

UNIT

PCIe AC coupling capacitor value

200

PCIe AC coupling capacitor package size(1)

0402

0603

EIA(2)

(1)

The physical size of the capacitor should be as small as practical. Use the same size on both lines in each pair, placed side by side.

(2)

EIA LxW units; that is, a 0402 is a 40x20 mil (thousandths of an inch) surface-mount capacitor.

8.16.3.2.2 Polarity Inversion

The PCIe specification requires polarity inversion support. This means, for layout purposes, polarity is

unimportant since each signal can change its polarity on-die inside the chip. This means polarity within a

lane is unimportant for layout.

8.16.3.3 Non-Standard PCIe Connections

The following sections contain suggestions for any PCIe connection that is not described in the official

PCIe specification, such as an on-board device-to-device connection, or device-to-other PCIe-compliant

processor connection.

8.16.3.3.1 PCB Stackup Specifications

Table 8-77 shows the stackup and feature sizes required for these types of PCIe connections.

Table 8-77. PCIe PCB Stackup Specifications

PARAMETER

MIN

TYP

MAX

UNIT

PCB Routing/Plane Layers

Layers

Signal Routing Layers

Layers

Number of ground plane cuts allowed within PCIe routing region

Cuts

Number of layers between PCIe routing area and reference plane(1)

Layers

PCB Routing clearance

Mils

PCB Trace width(2)

Mils

PCB BGA escape via pad size

Mils

PCB BGA escape via hole size

Mils

Processor BGA pad size(3)(4)

0.4

(1)

A reference plane may be a ground plane or the power plane referencing the PCIe signals.

(2)

In breakout area.

(3)

Non-solder mask defined pad.

(4)

Per IPC-7351A BGA pad size guideline.

8.16.3.3.2 Routing Specifications

The PCIe data signal traces must be routed to achieve 100

Ω (±20%) differential impedance and 60 Ω

(±15%) single-ended impedance. The single-ended impedance is required because differential signals are

extremely difficult to closely couple on PCBs and, therefore, single-ended impedance becomes important.

These requirements are the same as those recommended in the PCIe Motherboard Checklist 1.0

document, available from PCI-SIG.

These impedances are impacted by trace width, trace spacing, distance between signals and referencing

planes, and dielectric material. Verify with a PCB design tool that the trace geometry for both data signal

pairs result in as close to 100

Ω differential impedance and 60 Ω single-ended impedance as possible. For

best accuracy, work with your PCB fabricator to ensure this impedance is met.

Peripheral Information and Timings

259

Submit Documentation Feedback

Product Folder Links: DM385 DM388

DM385 Datasheet(PDF) 259 Page - Texas Instruments

DM385 Datasheet(HTML) 259 Page - Texas Instruments

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 ...More

Datasheet Download

Link URL