LP38856 datasheet(4/24 Pages) TI

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LP38856

SNVS336F – JUNE 2006 – REVISED AUGUST 2015

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6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

NOM

MAX

UNIT

VIN

Supply voltage

(VOUT + VDO)

VBIAS

Supply voltage

5.5

VEN

Enable input voltage

0.0

VBIAS

IOUT

Output current

mA/A

Junction temperature range(2)

–40

125

°C

(1)

Absolute maximum ratings indicate limits beyond which damage to the component may occur. Operating ratings indicate conditions for

which the device is intended to be functional, but do not ensure specific performance limits (see Electrical Characteristics).

Specifications do not apply when operating the device outside of its rated operating conditions.

(2)

Device power dissipation must be de-rated based on device power dissipation (TD), ambient temperature (TA), and package junction to

ambient thermal resistance (RθJA). Additional heat-sinking may be required to ensure that the device junction temperature (TJ) does not

exceed the maximum operating rating. See Application and Implementation for details.

6.4 Thermal Information

LP38856

THERMAL METRIC(1)

KTT (DDPAK/TO-263)

NDH (TO-220)

UNIT

5 PINS

RθJA

Junction-to-ambient thermal resistance

41.8

32.0

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

45.0

43.8

°C/W

RθJB

Junction-to-board thermal resistance

24.8

18.6

°C/W

ψJT

Junction-to-top characterization parameter

13.1

8.8

°C/W

ψJB

Junction-to-board characterization parameter

23.8

18.0

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

2.4

1.2

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

6.5 Electrical Characteristics

Unless otherwise specified: VIN = VOUT(NOM) + 1 V, VBIAS = 3 V, IOUT = 10 mA, CIN = COUT = 10 µF, CBIAS = 1 µF, VEN = VBIAS.

Limits apply for TJ = 25°C only unless otherwise specified. Minimum and Maximum limits are specified through test, design, or

statistical correlation. Typical values represent the most likely parametric norm at TJ = 25°C, and are provided for reference

purposes only.

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

VOUT(NOM) + 1 V ≤ VIN ≤ VBIAS

–1%

+1%

3 V

≤ VBIAS ≤ 5.5 V, 10 mA ≤ IOUT ≤ 3 A

VOUT(NOM) + 1 V ≤ VIN ≤ VBIAS

3 V

≤ VBIAS ≤ 5.5 V, 10 mA ≤ IOUT ≤ 3 A

–3%

VOUT

Output Voltage Tolerance

TJ = –40°C to 125°C

VOUT(NOM) + 1V ≤ VIN ≤ VBIAS

3 V

≤ VBIAS ≤ 5.5 V, 10 mA ≤ IOUT ≤ 3.0A

–2%

0°C

≤ TJ ≤ 125°C

ΔVOUT/ΔVIN

Line regulation, VIN

(1)

VOUT(NOM) + 1 V ≤ VIN ≤ VBIAS

0.04

%/V

ΔVOUT/ΔVBIAS

Line regulation, VBIAS

(1)

3 V

≤ VBIAS ≤ 5.5 V

0.10

%/V

ΔVOUT/ΔIOUT

Output voltage load regulation(2)

10 mA

≤ IOUT ≤ 3 A

0.2

%/A

IOUT = 3 A

240

300

VDO

Dropout voltage, VIN − VOUT

(3)

IOUT = 3 A, TJ = –40°C to 125°C

450

(1)

Output voltage line regulation is defined as the change in output voltage from nominal value resulting from a change in input voltage.

(2)

Output voltage load regulation is defined as the change in output voltage from nominal value as the load current increases from no load

to full load.

(3)

Dropout voltage is defined the as input to output voltage differential (VIN - VOUT) where the input voltage is low enough to cause the

output voltage to drop no more than 2% from the nominal value

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