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LP38856 Datasheet(PDF) 3 Page - Texas Instruments |
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LP38856 Datasheet(HTML) 3 Page - Texas Instruments |
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3 / 24 page  TAB IS GND BIAS OUT GND EN 1 2 3 4 5 IN TAB IS GND BIAS OUT GND EN 1 2 3 4 5 IN LP38856 www.ti.com SNVS336F – JUNE 2006 – REVISED AUGUST 2015 5 Pin Configuration and Functions KTT Package NDH Package 5-Pin DDPAK/TO-263 5-Pin TO-220 Top View Top View Pin Functions PIN TYPE DESCRIPTION NO. NAME 1 EN I The device enable pin. 2 IN I The unregulated input voltage pin 3 GND — Ground 4 OUT O The regulated output voltage pin 5 BIAS I The supply for the internal control and reference circuitry The TAB is a thermal connection that is physically attached to the backside of the die, and is TAB TAB — used as a thermal heat-sink connection. See the Application and Implementation section for details 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) (2) MIN MAX UNIT Power dissipation(3) Internally limited VIN Supply voltage (survival) –0.3 6 V VBIAS Supply voltage (survival) –0.3 6 V VEN Voltage (survival) –0.3 6 V VOUT Voltage (survival) –0.3 6 V IOUT Current (survival) Internally Limited TJ Junction temperature –40 150 °C Tstg Storage temperature –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) If Military/Aerospace specified devices are required, contact the TI Sales Office/ Distributors for availability and specifications. (3) Device power dissipation must be de-rated based on device power dissipation (TD), ambient temperature (TA), and package junction to ambient thermal resistance (RθJA). Additional heat-sinking may be required to ensure that the device junction temperature (TJ) does not exceed the maximum operating rating. See Application and Implementation for details. 6.2 ESD Ratings VALUE UNIT Electrostatic V(ESD) Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V discharge (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Copyright © 2006–2015, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Links: LP38856 |
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